Vol. 2023, Issue EMPC, 2023March 07, 2024 EDT
Assembly of Ultra-thin MEMS Device on Driver Chip Using Anisotropic Conductive Film
Assembly of Ultra-thin MEMS Device on Driver Chip Using Anisotropic Conductive Film
Nguyen, Hoang-Vu, and Knut Eilif Aasmundtveit. 2024. “Assembly of Ultra-Thin MEMS Device on Driver Chip Using Anisotropic Conductive Film.” IMAPSource Proceedings 2023 (EMPC): 274–78. https://doi.org/10.4071/001c.94814.