Characterization of Embedded and Thinned RF Chips

Ran Yin; Helmuth P. E. Morath; Christian Hoyer; Krzysztof Nieweglowski; Karsten Meier; Jens Wagner; Frank Ellinger; Karlheinz Bock

doi:10.4071/001c.94853

Yin, Ran, Helmuth P. E. Morath, Christian Hoyer, Krzysztof Nieweglowski, Karsten Meier, Jens Wagner, Frank Ellinger, and Karlheinz Bock. 2024. “Characterization of Embedded and Thinned RF Chips.” IMAPSource Proceedings 2023 (EMPC): 410–15. https://doi.org/10.4071/001c.94853.

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Characterization of Embedded and Thinned RF Chips

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