ISSN 2380-4505
Vol. 2023, Issue EMPC, 2023March 06, 2024 EDT
Understanding Cu Sintering and Its Role on Corrosion Behaviour for High-Temperature Microelectronic Application
Understanding Cu Sintering and Its Role on Corrosion Behaviour for High-Temperature Microelectronic Application
Kotadia, Hiren R., Juan Ignacio Ahuir-Torres, Sri Krishna Bhogaraju, Geoff West, and Gordon Elger. 2024. “Understanding Cu Sintering and Its Role on Corrosion Behaviour for High-Temperature Microelectronic Application.” IMAPSource Proceedings 2023 (EMPC): 211–15. https://doi.org/10.4071/001c.94752.