ISSN 2380-4505
Vol. 2023, Issue EMPC, 2023March 05, 2024 EDT
Characterization of a Novel Cost-efficient and Environmentally Friendly Graphene-enhanced Thermal Interface Material
Characterization of a Novel Cost-efficient and Environmentally Friendly Graphene-enhanced Thermal Interface Material
Articles in Vol. 2023, Issue EMPC, 2023
Vol. 2023, Issue EMPC, 2023
- UV Laser Copper Pad Surface Exposure for Laser Direct Structuring (LDS) of InterconnectionGuendalina CatalanoAlessandro Mellina GottardoRiccardo Villa
- Thermally Conductive Polymer Composites with Hexagonal Boron Nitride for Medical Device Thermal ManagementNu Bich Duyen DoKristin ImenesKnut E. AasmundtveitHoang-Vu NguyenErik Andreassen
- Thermal-Mechanical Analysis of a Power Module with Parametric Model Order ReductionSheikh HassanPushparajah RajaguruStoyan StoyanovChristopher Bailey
- Testing of Electromigration Resistance of Copper and Silver Thick FilmsJiri HlinaJan RebounMarek SimonovskyAles Hamacek
- Study of Spatial Distortion in InP Nanophotonic Membranes on Different Carrier SubstratesSalim AbdiAleksandr ZozuliaJeroen BolkErik Jan GelukKevin WilliamsYuqing Jiao
- Reliability of Copper Sintered Interconnects under Extreme Thermal Shock ConditionsSri Krishna BhogarajuFrancesco UgoliniFederico BelponerAlessio GreciGordon Elger
- Reliability Testing of Recycled SMD Components Reused in E-Textiles after Ageing by Washing CyclesMartin HirmanJiri NavrátilAndrea BenesováFrantisek Steiner
- Process Window of Mini-LED Display Panel Packaging using Laser Assisted Bonding TechnologyYong-Sung EomGwang-Mun ChoiKi-Seok JangJi-Ho JooChan-Mi LeeJin-Heuk OhSeok-Hwan MoonKwang-Seong Choi
- Practical Study to Demonstrate an Increase in the Reliability of Flip Chip Connections by Adding Nanoparticles to SolderDavid M. HarveyTeresa Partida ManzaneraKangkana BaishyaGuangming ZhangMohd Arif Anuar Mohd Salleh ArifY. C. ChanNduka EkereDerek Braden
- Partial Discharge Characterization of Ceramic Power Electronics Circuit Carriers Assisted by Machine LearningJohannes DrechselHenry BarthLars Rebenklau
- One-Probe Nanoprobing of Power Devices and Electronic PackagesGreg M. JohnsonChengliang HuangVignesh ViswanathanAndreas RummelHeiko StegmannElliott AndrewAllen GuMasako TeradaThomas Rodgers
- Novel Low Temperature and Low Pressure Sintering of ADAS Radar Sensor Antenna StackSri Krishna BhogarajuNihesh MohanFabian SteinbergerHueseyin ErdoganPhilipp HadravaGordon Elger
- Negative-tone Photo-definable Polyimide with High Thermal Stability and Thick Film ProcessabilityHitoshi ArakiTakayuki KanekiYu ShojiChika Hibino
- Investigation of Aluminum and Gold Flip-Chip Bonding for Quantum Device IntegrationI. CirulisU. ZschenderleinS. BraunM. RadestockR. PantouK. VogelF. SelbmannS. KurthB. WunderleH. Kuhn
- Inspection Techniques Using Scanning Acoustic Microscopy for Silver Sintering Applications in Power Electronic ModulesHeaklig AyalaJose Ortiz GonzalezMohammed-Amer KaroutJames CottyTim RumneyPhilip Mawby
- Influence of Thermally Aged Underfill on Flip-Chip PackagesKevin CoxGhassan Abu-HamdehMatt Borden
- Improving Semiconductor Reliability of Silver Sintering Die-Attach Adhesives for Large Die on Copper Lead FramesRuud de WitHenry MartinXinpei CaoJan WijgaertsEdsger SmitsBo Xia
- Improvement of Bonding Strength and Thermal Shock Reliability for Ag Sinter Joining Direct on Al SubstrateChuantong ChenRan LiuKoji KobayashiHideyo OsanaiZheng ZhangKatsuaki Suganuma
- High-Q Ku-band Microstrip Spiral Resonator in Fan-out Wafer-Level Packaging (FoWLP) Technology for VCO ApplicationsMykola ChernobryvkoMichael P. KaiserKavin Senthil MurugesanDan KuylenstiernaJulia-Marie KöszegiRobert GernhardtTanja BraunIvan NdipMartin Schneider-Ramelow
- High Frequency Bandwidth Transition for HTCC Hermetic PackagesEmad Elrifai
- Gas Permeable Protection Caps for Wafer Level Chip Scale Packaging (WLCSP) of MEMS Environmental SensorsOle BehrmannThomas LisecFinn KlingbeilNiklas KyoushiBjörn Gojdka
- Flip-Chip Interconnects Based on Single Metal-Coated Polymer SpheresVan Long HuynhKnut E. AasmundtveitHoang-Vu Nguyen
- Flexible Hybrid Electronics on Wearable Healthcare ApplicationMing-Hung ChenWei-Hao ChangTun-Ching PiWei-Chun LeeJen-Chieh KaoYung-I Yeh
- Durability of Lead-Free Solder Interconnections for Printed Circuit Board Applications: Comparing Energy-Based Thermo-Mechanical Fatigue ModelsChien-Ming HuangJeffrey W. Herrmann
- Development of a Stretchable and Removable Electrical Interconnection Solution for Ultra-Thin Electronic ComponentsAuriane Despax-FerreresPascal TiquetJean-Charles SouriauVincent JousseaumeJulia De Girolamo
- Development and Characterizations of Fine Pitch Flip-Chip Interconnection Using Silver SinteringJulie GougeonJean-Charles SouriauLaurent MendizabalCéline FeautrierRémi FraniatteMona Tréguer-DelapierreEdouard Deschaseaux
- Concepts for realizing High-Voltage Power Modules by Embedding of SiC SemiconductorsLars BöttcherAndreas OstmannThomas LöherManuel Seckel
- Comparing the Solderability of Different SA C0307 Composite Solder PastesBalázs IllésHalim ChoiAgata Skwarek
- Characterizations for eWLB (Embedded Wafer Level Ball Grid Array) Antenna in Molded Package Integrations in 77GHz Automotive ApplicationsMing-Che HsiehFrank ZhangForest ZhuKang LiuLinda ChuaYaojian LinJoel A. DamalerioHin Hwa GohKai Chong ChanZihao Chen
- Characterization of a Novel Cost-efficient and Environmentally Friendly Graphene-enhanced Thermal Interface MaterialKristoffer Harr (Martinsen)Sihua GuoJiajia ChenAmos NkansahZhiyang ShenMurali MurugesanHongfeng ZhangLars AlmhemArto AhtonenJin ChenJohan Liu
- Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) ProcessKi-Seok JangYong-Sung EomGwang-Mun ChoiJiho JooJin-Hyuk OhChan-Mi LeeYoon-Hwan MoonSeok-Hwan MoonKwang-Seong Choi
- Additive Metallization of Alumina with Copper-Titanium Powder Blends for Power Electronic ApplicationsChristoph HechtEric SchadowMario SprengerFelix HaeusslerThomas StollJoerg Franke
- A High-Density Organic Package Solution to W-band SiGe Flip-Chip ApplicationsFirat AltuntasNihan OznazliOlcay KalkanEmrah Koc
- A Dual-Band Dual-Polarized 2x2 Antenna Array with Beamforming for 5G AiP and mmWave ApplicationsSheng-Chi HsiehHong-Sheng HuangWen-Chun HsiaoCheng-Yu HoChen-Chao Wang
- Understanding the Contact Resistance in an ACF BondingHelge KristiansenGiang M. NghiemMolly BazilchukKnut E. Aasmundtveit
- Understanding Cu Sintering and Its Role on Corrosion Behaviour for High-Temperature Microelectronic ApplicationHiren R. KotadiaJuan Ignacio Ahuir-TorresSri Krishna BhogarajuGeoff WestGordon Elger
- Thermal Design of Stacked Power Modules for Electric Drive ApplicationsJianfeng LiYuekang DuXingzhi WangLiangjie LiuYong PangFeixiang Liu
- Silver Bonding Wire - an Alternative for Mechanical Sensitive Chip Configurations in Automotive Electronics PackagingRobert KlengelSandy KlengelSebastian TismerNoritoshi ArakiMotoki EtoTeruo HaibaraTakashi YamadaJochen FeldmannAchim ScheerRalph BinnerHenk Peters
- Pick and Place of Sensitive Chips with Vacuum-Free Gecomer® ToolsLukas LorenzThomas LudewigKai Chong SwiecinskiHenrik OllmannAmirabbas RazkordanisharahiVolker Bock
- Microstructural Based Reliability Investigation of Water- and Suspension Free Prepared Integrated Electronic PackagesSandy KlengelRobert KlengelTino Stephan
- Lamination of Capacitive Micromachined Ultrasonic Transducer on a Piezoelectric Array: Process and EvaluationDuy Hoang LeTung ManhLars Hoff
- LTCC-based Ceramic Substrates for Identification of Trustworthy ElectronicsUwe KriegerAnnett SchroeterFranz BechtoldGunter HagenAdrian Goldberg
- Interconnect Stress Testing as a Tool for Assessment of Reliability of Modern PCBsMarek KoscielskiKrzysztof GlinskiDariusz OstaszewskiJan OklejTomasz KlejAneta CholajWojciech SteplewskiStefan GalinskiJanusz Borecki
- Innovative Silicon-Ceramic (SiCer) Technology for High-Strength Pressure Sensor Applications Using Different Manufacturing MethodsCathleen KleinholzMichael FischerNam GutzeitAndrea CyriaxMichael HintzThomas OrtleppJens Müller
- Initial Life Test of Silicone Encapsulated FR 4 Printed Circuit Boards for Pre-Clinical Active ImplantsHenry T. LancashireIshpa AliFei XueCarlos Perez HenriquezThomas NiederhofferAhmad Shah IdilDai Jiang
- Impact of Pad Layouts and Solder Volume on Self- Alignment of Micro Solar CellsElisa KaiserMaike WiesenfarthVictor VareillesHenning Helmers
- Evaluation of the Environmental Impact within Semiconductor Packaging MaterialsJeff KettleAndrew BainbridgeKathleen GrantLewis Clark
- Epoxy Molding Compound Bleeding Reduction on Surface Mount Semiconductor DeviceFederico LeoneFulvio VivianiHidetoshi SekiMasami Ishii
- Enhanced Reliability for Power Modules via a New Ag/Si Sinter Joining StrategyYang LiuChuantong ChenKoji S. NakayamaMinoru UeshimaTakeshi SakamotoNaoe TakuyaHiroshi NishikawaKatsuaki Suganuma
- Rapid Sintering of Inkjet Printed Cu Complex Inks Using Laser in AirNihesh MohanJuan Ignacio Ahuir-TorresSri Krishna BhogarajuHiren R. KotadiaGordon Elger
- MEMS Mirror in Hermetic Package for Enhanced PerformancesLuca MaggiMarco Del SartoAmedeo MaiernaMark ShawRoberto CarminatiGianluca MendicinoDavide RottaMarco ChiesaAina Serrano RodrigoAntonella Bogoni
- Integration of Multi-Lithography Technologies for the Fabrication of Flexible Optical LinkAkash MistryKrzysztof NieweglowskiKarlheinz Bock
- High Speed Transmission Characteristics on Glass Based InterposersSatoru KuramochiMasaya TanakaTakahiro Tai
- From MEMS Strip to MEMS Unit: a Comprehensive Simulation Approach to WarpageAndrea RattiDaniele SimonciniAnnabel AdolfoMarco Del SartoAlex GrittiPatrick FedeliLuca MaggiTeresa NapolitanoMark Andrew ShawJefferson Talledo
- Evolution of Getter Technology in Electronic Hermetic PackagingLuca MauriGiovanni ZafaranaEnea RizziAlessio Corazza
- Effect of Surface Microstructure on Joints Using Nanoporous Cu Sheet for Power DevicesHiroshi NishikawaByungho ParkMikiko SaitoJun Mizuno
- Design, Fabrication, and Characterization of a 4H-SiC CMOS Readout Circuit for Monolithic Integration with SiC SensorsRomina SattariHenk van ZeijlGuoqi Zhang
- Cu Pumping Analysis during Cu/SiO2 Hybrid Bonding using In-situ SPM ImagingAli RoshanghiasJaroslaw KaczynskiUde Hangen
- Assembly of Ultra-thin MEMS Device on Driver Chip Using Anisotropic Conductive FilmHoang-Vu NguyenKnut Eilif Aasmundtveit
- Application of Machine Learning Methods for Process Optimization in Electronic Packaging ProcessesCorinna NiegischSabine T. HaagTanja BraunOle HoelckMartin Schneider-Ramelow
- Analysis and Characterization of Castellated Holes as RF Interconnects for Modular Millimeter-Wave DevicesPaul PerlwitzChristian TschobanIvan NdipHarald PötterMartin Schneider-Ramelow
- Adhesive Solutions for Closed Cavity PackagingPatrick SchirmerSeverin Ringelstetter
- Adhesion Copper/Molding Compound: Modeling and CharacterizationMarco RovittoSamuele ZalaffiCarlo PassagrilliClaudio Maria VillaLuca AndenaStefano Mariani
- Voiding in Parylene-C Encapsulation of Surface Mount LEDs for an Optogenetic Epilepsy NeuroprosthesisAhmad Shah IdilRichard BaileyEnrique Escobedo-CousinJohannes GausdenAntony O’NeillNick Donaldson
- Thickness Effect of Copper Clips on Power Module Packaging DesignHaiyong WanNikolaos IosifidisXu ZhangRui RongMarina AntoniouPhilip Mawby
- Research of Chip Placement Accuracy for Fan-Out WLP using A Novel Self-Assembly StageTadatomo YamadaKen TakanoToshiaki MenjoShinya Takyu
- Numerical Study on the Influence of Polyimide Thickness and Curing Temperature on Wafer Bow in Wafer Level PackagingPrashant Kumar SinghPatrick RohlfsGunther SandmannKashi Vishwanath MachaniDirk BreuerKarsten MeierFrank KuechenmeisterMarcel WielandKarlheinz Bock
- Measurement and Simulation of Mechanical Strength of Back-End-Of-Line Layer in Advanced CMOS DiesBart VandeveldeKevin CoxReza MoloudiRiet LabieJason KrantzMatt BordenKris VanstreelsMario Gonzalez
- Laser-Assisted Bonding Approach for Photonic Integration ProcessesAleksandr A. VlasovTopi UusitaloEvgenii LepukhovHeikki VirtanenSamu-Pekka OjanenJukka ViheriäläMircea Guina
- Hybrid Lithography Fabrication of Single Mode Optics for Signal Redistribution and CouplingDavid WeyersKrzysztof NieweglowskiKarlheinz Bock
- High Frequency Thin Film Magnetics-on-Silicon with Improved Inductance and ResistanceMartin SittnerMahmoud ShoushaMartin Haug
- Fine Pitch Micro Indium Bump Interconnect Flip Chip BondingTravis Scott
- Deposition of Fine-Pitch Indium Bumps on Single DieAndreas SchneiderNavid GhorbanianDavid BurtJames HollinghamPaul BookerToby G. BrooksJohn D. LippMarcus J. French
- Characterization of Embedded and Thinned RF ChipsRan YinHelmuth P. E. MorathChristian HoyerKrzysztof NieweglowskiKarsten MeierJens WagnerFrank EllingerKarlheinz Bock
- Ceramic Embedding of SiC-Semiconductor Using Cofiring TechnologySteffen ZiescheKathrin ReinhardtJobin VargheseBirgit ManhicaAndreas Schletz
- Assembly of Printed Interconnects for Immobilized Protein Microfluidic AssaysQianwen XuS. W. Ricky LeeYusong GuoJeffery C. C. Lo
- Application of Reactive Bonding Methods on LTCC SubstratesErik WissAlexander SchulzAdam YuileJens MuellerSteffen Wiese
- Analysis of the Impact of Environmental Conditions on the Reliability in 5G PCB AssembliesHans WalterOlaf WittlerMarius van DijkSaskia HuberJulia-Marie KöszegiMartin Schneider-Ramelow
- An Innovative Conformal Electronically Scanned Array Antenna for full 360° Steerability in the Ka-bandPeter UhligAline FriedrichMarkus KrengelWinfried SimonOliver Litschke
- An Experimental Investigation of a Flexible Sintered Silver Joint for Micro-Joining Based on a Design of ExperimentsLaurent VivetLahouari BenabouOlivier Simon
- Advances in Parylene Adhesive Bonding for the Realization of Biocompatible MicrosystemsFranz SelbmannFrank RoscherMaik WiemerHarald KuhnYvonne Joseph
- 20 μm Copper Micro-Bump Bonding Through a Silver Metallization for Advanced Packaging Under a Low Pressure ConditionZheng ZhangMing-Chun HsiehAiji SuetakeHiroshi YoshidaRieko OkumuaraNoriko KagamiKazamasa OkamotoChuantong ChenKei HashizumeNorihiko HasegawaRyuji YoshidaHidekazu HommaKatsuaki Suganuma
Harr (Martinsen), Kristoffer, Sihua Guo, Jiajia Chen, Amos Nkansah, Zhiyang Shen, Murali Murugesan, Hongfeng Zhang, et al. 2024. “Characterization of a Novel Cost-Efficient and Environmentally Friendly Graphene-Enhanced Thermal Interface Material.” IMAPSource Proceedings 2023 (EMPC): 115–18. https://doi.org/10.4071/001c.94694.