Fine Pitch Micro Indium Bump Interconnect Flip Chip Bonding | Published in IMAPSource Proceedings

IMAPSource Conference Papers

Scott, Travis. 2024. “Fine Pitch Micro Indium Bump Interconnect Flip Chip Bonding.” IMAPSource Proceedings 2023 (EMPC): 329–33. https://doi.org/10.4071/001c.94828.

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