Interconnect Stress Testing as a Tool for Assessment of Reliability of Modern PCBs

Marek Koscielski; Krzysztof Glinski; Dariusz Ostaszewski; Jan Oklej; Tomasz Klej; Aneta Cholaj; Wojciech Steplewski; Stefan Galinski; Janusz Borecki

doi:10.4071/001c.94751

Koscielski, Marek, Krzysztof Glinski, Dariusz Ostaszewski, Jan Oklej, Tomasz Klej, Aneta Cholaj, Wojciech Steplewski, Stefan Galinski, and Janusz Borecki. 2024. “Interconnect Stress Testing as a Tool for Assessment of Reliability of Modern PCBs.” IMAPSource Proceedings 2023 (EMPC): 206–10. https://doi.org/10.4071/001c.94751.

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Interconnect Stress Testing as a Tool for Assessment of Reliability of Modern PCBs

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