Numerical Study on the Influence of Polyimide Thickness and Curing Temperature on Wafer Bow in Wafer Level Packaging

Prashant Kumar Singh; Patrick Rohlfs; Gunther Sandmann; Kashi Vishwanath Machani; Dirk Breuer; Karsten Meier; Frank Kuechenmeister; Marcel Wieland; Karlheinz Bock

doi:10.4071/001c.94832

Singh, Prashant Kumar, Patrick Rohlfs, Gunther Sandmann, Kashi Vishwanath Machani, Dirk Breuer, Karsten Meier, Frank Kuechenmeister, Marcel Wieland, and Karlheinz Bock. 2024. “Numerical Study on the Influence of Polyimide Thickness and Curing Temperature on Wafer Bow in Wafer Level Packaging.” IMAPSource Proceedings 2023 (EMPC): 345–50. https://doi.org/10.4071/001c.94832.

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