Vol. 2023, Issue EMPC, 2023March 05, 2024 EDT
Process Window of Mini-LED Display Panel Packaging using Laser Assisted Bonding Technology
Process Window of Mini-LED Display Panel Packaging using Laser Assisted Bonding Technology
Yong-Sung Eom, Gwang-Mun Choi, Ki-Seok Jang, Ji-Ho Joo, Chan-Mi Lee, Jin-Heuk Oh, Seok-Hwan Moon, Kwang-Seong Choi,
Eom, Yong-Sung, Gwang-Mun Choi, Ki-Seok Jang, Ji-Ho Joo, Chan-Mi Lee, Jin-Heuk Oh, Seok-Hwan Moon, and Kwang-Seong Choi. 2024. “Process Window of Mini-LED Display Panel Packaging Using Laser Assisted Bonding Technology.” IMAPSource Proceedings 2023 (EMPC): 107–10. https://doi.org/10.4071/001c.94690.