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Device Packaging Conference Presentations
Vol. 2010, Issue DPC, 2010January 01, 2010 EDT

Passive Device Integration from Silicon Technology

Kai Liu, YongTaek Lee, HyunTai Kim, Gwang Kim, Guruprasad Badakere, Yaojian Lin, Billy Ahn,
Passive IntegrationRF SiPSmall form-factor
https://doi.org/10.4071/2010DPC-wp36
IMAPSource Conference Papers
Liu, Kai, YongTaek Lee, HyunTai Kim, Gwang Kim, Guruprasad Badakere, Yaojian Lin, and Billy Ahn. 2010. “Passive Device Integration from Silicon Technology.” IMAPSource Proceedings 2010 (DPC): 1967–89. https:/​/​doi.org/​10.4071/​2010DPC-wp36.
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