ISSN 2380-4505
Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
ALX Polymer for Wafer Level Packaging: Mechanical Property Evaluation After Multiple Lead-Free Solder Reflows
ALX Polymer for Wafer Level Packaging: Mechanical Property Evaluation After Multiple Lead-Free Solder Reflows
Takeshi Eriguchi, Orson Wang, Kaori Tsuruoka, Yuichiro Ishibashi, Yong Zhang,
Eriguchi, Takeshi, Orson Wang, Kaori Tsuruoka, Yuichiro Ishibashi, and Yong Zhang. 2010. “ALX Polymer for Wafer Level Packaging: Mechanical Property Evaluation After Multiple Lead-Free Solder Reflows.” IMAPSource Proceedings 2010 (DPC): 1054–79. https://doi.org/10.4071/2010DPC-tp34.