ISSN 2380-4505
Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
A Review of Wafer Coating Methods for 3D Packaging
A Review of Wafer Coating Methods for 3D Packaging
Steven J. Adamson, James Klocke, Gareth De Sanctis,
Articles in Vol. 2010, Issue DPC, 2010
Vol. 2010, Issue DPC, 2010
- ALX Polymer for Wafer Level Packaging: Mechanical Property Evaluation After Multiple Lead-Free Solder ReflowsTakeshi EriguchiOrson WangKaori TsuruokaYuichiro IshibashiYong Zhang
- Improved Heat Dissipation and Optical Performance of High-power LED Packaging with Sintered Nanosilver Die-attach MaterialPaul PanaccioneTao WangGuo-Quan LuXu ChenSusan Luo
- 3D Modeling of Complex Combinations of Dies, Packages, Lead Frames, Sockets and Test Boards for Electrical, Thermal and Manufacturing Verification of Advanced Semiconductor DevicesJohn Sovinsky
- Processing of Lithographically Defined Apex Glass Structures with Smooth and Transparent SidewallsKhalid H.M. TantawiJaneczka OatesJohn D. Williams
- 3D Passive Integrated Capacitors Towards Even Higher IntegrationSophie GaborieauCatherine BunelFranck Murray
- High Flux Value Micro-Heat Pipe ArraysDaniel K. HarrisRobert DeanAshish PalkarGary Wonacott
- Integration of Electroactive Polymers in MEMS Ultrasonic SensorsMichael KranzMichael WhitleySharon SanchezMichael Allen
- Evaluation of Cu/Sn-Cu Bump Bonding Processes for 3D Integration Using a Fluxing AdhesiveAlan HuffmanJason ReedMatthew LueckChristopher GregoryDorota TempleRuss Stapleton
- Coreless Substrate Design, Assembly and Reliability for High Speed ApplicationsJon AdayNozad KarimMike DevitaSteven Lee
- Nano-Porous Gold InterconnectHermann OppermannLothar DietrichMatthias KleinBernhard WunderleHerbert Reichl
- Advances in 3D Memory and Logic DevicesRobert Patti
- Vacuum Packaged Silicon MEMS Gyroscope with Q-Factor Above 0.5 MillionAlexander A. TrusovA. R. SchofieldA. M. Shkel
- Electroplated Copper Pillar Feature EffectsJim ZhangArthur KeiglerZhen LiuRichard Hollman
- Design of a MEMS Force Sensor for Quantitative Measurement in the Nano- to Pico-Newton RangeLi-Anne LiewJohn M. MorelandJonathan R. Pratt
- Thermal Design of the High Brightness Thin LCDsD. ChestakovG. CenniniL. AlbaniS. Bonfiglio
- A High Performance and Cost Effective Molded Array Package SubstratePhilip E. RogrenPierangelo MagniMaura MazzolaMark ShawGiovanni GraziosiClaudio Maria Villa
- Advances in WLCSP Technologies to Enable Cost-ReductionRex AndersonR. ChilukuriB. RogersA. Syed
- Underfill Design for Low-k Dielectrics and Lead Free ApplicationsBrian SchmaltzYukinari AbeKazuyuki Kohara
- System Level Thermal Performance Evaluation of Inverted Exposed Pad PackagesVictor Chiriac
- 3D TSV Interposer Technology with Cu/SnAg Microbump InterconnectionsSeung Wook YoonDzafir ShariffJae Hun KuPandi Chelvam MarimuthuFlynn Carson
- Advanced SiP Packaging Technologies of IPD for Mobile ApplicationsGeun Sik KimKai LiuFlynn CarsonSeung Wook YoonMeenakshi Padmanathan
- A Review of Wafer Coating Methods for 3D PackagingSteven J. AdamsonJames KlockeGareth De Sanctis
- Thin Film Packaging Reinforcement for Overmolded MEMSGillot CharlotteJean-Louis PorninChristophe BillardEmannuelle LagouteMihel PellatGuy ParatNicolas Sillon
- Effect on Reliability of Bending Flexible CircuitsJohn DzarnoskiKexia Sun
- Next Generation System in a Package Manufacturing by Embedded Chip TechnologiesLars BoettcherA. OstmannD. ManessisS. KaraszkiewiczH. Reichl
- Localized Parylene-C Bonding for Micro Packaging and Cell Encapsulation using Reactive Multilayer FoilsXiaotun QiuDavid WelchJennifer Blain ChristenRui TangJie ZhuJonathon OilerCunjiang YuZiyu WangHongyu Yu
- Optimal Thermal Management of Microelectronic PackagesVictor Chiriac
- Integration of Electrografted Layers for the Metallization of Deep TSVsClaudio TruzziF. RaynalV. MevellecN. FrederichD. SuhrI. BispoB. Couturier
- Thermal Dissipation-It's Not Rocket ScienceFranklin WallSal Cassarino
- LED & HB-LED Packaging: Technology & Marketing TrendsJeff Perkins
- Contract Wafer Bumping of Compound SemiconductorsAndrew StrandjordThorsten TeutschAxel SchefflerBernd OttoJing Li
- TLP Bonding Technologies for Micro Joining and 3D PackagingKei MurayamaMitsuhiro AizawaMitsutoshi Higashi
- Passive Device Integration from Silicon TechnologyKai LiuYongTaek LeeHyunTai KimGwang KimGuruprasad BadakereYaojian LinBilly Ahn
- Journey Toward Process Convergence in TSV TechnologySesh RamaswamiJohn Dukovic
- Characterization of Wafer Level Metal Thermo-Compression BondingErkan CakmakBioh KimViorel Dragoi
- ZoneBOND™ Thin Wafer Support Process for Wafer Bonding ApplicationsJeremy McCutcheonRobert BrownJoElle Dachsteiner
- Flexible On-Chip Inductors and TransformerJames J. Wang
- Development of MEMS Power Sensor PackageBruce C. KimRahim Kasim
- Analysis of Silicon Micromachining by UV Lasers, and Implications for Full Cut Laser Dicing of Ultra-Thin Semiconductor Device WafersAndy HooperDaragh Finn
- Migration to FC in the Wireless Application Space and Associated ChallengesSteve Bezuk
- Enabling Thin Wafer Metal to Metal Bonding through Integration of High Temperature Polyimide Adhesives and Effective Copper Surface CleanersAnthony B. RardinSimon J. KirkMel P Zussmann
- Challenges Facing Resonant MEMS SensorsMichael Kranz
- Advanced TSV Copper Electrodeposition for 3D Interconnect ApplicationsRozalia BeicaPaul SiblerudDave Erickson
- Novel Polymeric Protective Coatings for Hydrofluoric Acid Vapor Etching during MEMS Release EtchTingji TangCurt PlanjeRamachandran K. TrichurXing-Fu ZhongShelly FowlerGu XuKimberly YessXie ShaoDaniel J. Vestyck
- No Flow Underfill Process Development for Fine Pitch Flip Chip Silicon to Silicon Wafer Level IntegrationZhaozhi LiJohn L. EvansPaul N. HoustonBrian J. LewisDaniel F. BaldwinSangil LeeTheodore G. TessierEugene A. Stout
- Via Last using Polymer Liners and their ReliabilityDeniz Sabuncuoglu TezcanBivragh MajeedYann CivalePhilippe SoussanEric Beyne
- A High-Sensitivity Resonant Sensor Realised Through the Exploitation of Nonlinear Dynamic BehaviourWilliam WaughB. J. GallacherJ. S. Burdess
- Aerosol Jet® Printing of High Density, 3-D Interconnects for Multi-Chip PackagingMichael J. RennBruce H. KingMichael O'ReillyJeff S. LealSuzette K. Pangrle
- The European 3D Technology Platform (e-CUBES)Peter RammArmin KlumppJosef WeberThomas FritzschMaaike TakloNicolas LietaerWalter De RaedtThierry HiltPascal CoudercChristian ValAlan MathewsonKafil M. RazeebFrank Stam
- Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing To Avoid Thin Wafer HandlingMel ZussmanChris MilasincicAnthony RardinSimon KirkT. Itabshi
- Enabling Wafer Level Processes for CIS ManufacturingEric F. PaboGarrett OakesRon MillerPaul LindnerGerald KreindlThorsten MatthiasV. DragoiM. Wimplinger
- Die-to-Wafer Bonding of Thin Dies using a 2-Step Approach; High Accuracy Placement, then Gang BondingGilbert LecarpentierRahul AgarwalWenqi ZhangParesh LimayeRiet LabieA. PhommahaxayP. Soussan
- Stacking of Known Good Rebuilt Wafers without TSV - Applications to Memories and SiPChristian ValPascal CoudercPierre Lartigues
- A Parametrically Amplified MEMS GyroscopeBarry J. GallacherZ. X. HuJ. S. BurdessK. M. Harish
- A Micromachined Robust Planar Triggered Sparkgap Switch for High Power Pulse ApplicationsThomas A. BaginskiRobert N. DeanEd J. Wild
- A Robust Wafer-Level Capping Approach for MEMS DevicesKrishnan SeetharamanBart van VelzenHans van ZadelhoffCadmus YuanFrank RietveldCoen TakJoost van BeekJan-Jaap KoningPeter H. C. MagnéeJohannes van WingerdenHerman C. W. Beijerinck
- Integration Aspects of the Implementation of Through Silicon Vias (TSV) for CMOS Image SensorsDave ThomasJean MichailosNicolas HotellierGilles MetellusFrancois GuyaderAlain InardKeith BuchananDorleta Cortaberria SanzYiping SongTony Wilby
- 3D Interconnect: The Challenges AheadBrandon Prior
- Electromigration Performance of WLPs with Standard and Polymer Core BallsL. NguyenH. NguyenA. Prabhu
- Electrolytic Solder Deposit for Next Generation Flip Chip Solder BumpingStephen KennySven LamprechtKai MatejatBernd Roelfs
- Direct Cu Wet Seed on Barrier of TSV WaferJianwen HanXuan LinYun ZhangJoseph AbyThierry Mourier
- Bimorph Diaphragm Formed by Two PZT Sheets on Micromachined Silicon for Sound GenerationYoungki ChoeShih-Jui ChenEun Sok Kim
- Micro IMU Utilizing Folded MEMS ApproachMontgomery C. RiversAlexander A. TrusovSergei A. ZotovAndrei M. Shkel
- A Comparison of Flip Chip Bump Electromigration Reliability for Cu Pillar, High Pb, SnAg, and SnPb Bump StructuresAhmer SyedKarthikeyan DhandapaniLou NichollsRobert MoodyC. J. BerryRobert Darveaux
- Implementing Fringing Field Sensors in PCB TechnologyRobert DeanAditi RaneColin StevensMichael BaginskiZane HartzogDavid Elton
- Wafer Level Packaging Cost ModelingChet A. Palesko
- PCBMEMS as a Flexible Path to Devices and Systems across Spatial ScalesDavid P. FriesStanislav Z. IvanovHeather BroadbentMatthew SmithGeorge SteimleRoss Willoughby
- Through Silicon Via Technology: Cost effective Cu-TSV Interconnects by EMC3D and Technical Challenges with Cu-TSVPaul SiblerudRozalia BeicaBioh KimErik Young
- Thermally Conductive (TC) Plastics in LED LampsRob JanssenIr. L. DouvenH. K. van Dijk
- Study of Thermo-Mechanical Reliability of TSV for 8-Layer Stacked Multi Chip PackageSung-Hoon ChoaJin Young ChoiCha Gyu SongHaeng Soo Lee
- High Directivity Couplers using Multilayer Organics (MLO)George WhiteMinu ValayilCharlie RussellSid Dalmia
- Underfill Induced Tensile Strain Ratcheting and its Effect on Flip Chip Solder Bump FatigueCraig D. HillmanRandy SchuellerGreg Caswell
- Polyamide 4T: A New Lead-Free Solderable Polymer Enabling Packaging Technology Through Micro Molding and LDSTamim Sidiki
- Boron Nitride in Thermoplastics (for LED Housings)Thomas RappeltChandrashekar Raman
- Fluidic Devices in PCB TechnologyMathias NowottnickLienhard PagelStefan Gassmann
- A New Wave of Innovation in Micro-Technology for Positioning, Navigation, and Timing (μPNT)Andrei M. Shkel
- Process Control for Wet Etching for Silicon Wafer ThinningLaura MauerHerman ItzkowitzJohn Taddei
- The Use of Metallographic and SEM Analysis for Characterization of Sidewall Surfaces in MEMS Devices with DRIE ProcessingLee LevineRobert DeanColin StevensSamuel Lawrence
- ENEP – A Cost-Effective Alternative for High Reliability Soldering ApplicationsGustavo RamosMustafa OezkoekSven LamprechtHugh Roberts
Adamson, Steven J., James Klocke, and Gareth De Sanctis. 2010. “A Review of Wafer Coating Methods for 3D Packaging.” IMAPSource Proceedings 2010 (DPC): 2153–88. https://doi.org/10.4071/2010DPC-tha16.