ISSN 2380-4505
Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
High Flux Value Micro-Heat Pipe Arrays
High Flux Value Micro-Heat Pipe Arrays
Daniel K. Harris, Robert Dean, Ashish Palkar, Gary Wonacott,
Articles in Vol. 2010, Issue DPC, 2010
Vol. 2010, Issue DPC, 2010
- ALX Polymer for Wafer Level Packaging: Mechanical Property Evaluation After Multiple Lead-Free Solder ReflowsTakeshi EriguchiOrson WangKaori TsuruokaYuichiro IshibashiYong Zhang
- Improved Heat Dissipation and Optical Performance of High-power LED Packaging with Sintered Nanosilver Die-attach MaterialPaul PanaccioneTao WangGuo-Quan LuXu ChenSusan Luo
- 3D Modeling of Complex Combinations of Dies, Packages, Lead Frames, Sockets and Test Boards for Electrical, Thermal and Manufacturing Verification of Advanced Semiconductor DevicesJohn Sovinsky
- Processing of Lithographically Defined Apex Glass Structures with Smooth and Transparent SidewallsKhalid H.M. TantawiJaneczka OatesJohn D. Williams
- 3D Passive Integrated Capacitors Towards Even Higher IntegrationSophie GaborieauCatherine BunelFranck Murray
- High Flux Value Micro-Heat Pipe ArraysDaniel K. HarrisRobert DeanAshish PalkarGary Wonacott
- Integration of Electroactive Polymers in MEMS Ultrasonic SensorsMichael KranzMichael WhitleySharon SanchezMichael Allen
- Evaluation of Cu/Sn-Cu Bump Bonding Processes for 3D Integration Using a Fluxing AdhesiveAlan HuffmanJason ReedMatthew LueckChristopher GregoryDorota TempleRuss Stapleton
- Coreless Substrate Design, Assembly and Reliability for High Speed ApplicationsJon AdayNozad KarimMike DevitaSteven Lee
- Nano-Porous Gold InterconnectHermann OppermannLothar DietrichMatthias KleinBernhard WunderleHerbert Reichl
- Advances in 3D Memory and Logic DevicesRobert Patti
- Vacuum Packaged Silicon MEMS Gyroscope with Q-Factor Above 0.5 MillionAlexander A. TrusovA. R. SchofieldA. M. Shkel
- Electroplated Copper Pillar Feature EffectsJim ZhangArthur KeiglerZhen LiuRichard Hollman
- Design of a MEMS Force Sensor for Quantitative Measurement in the Nano- to Pico-Newton RangeLi-Anne LiewJohn M. MorelandJonathan R. Pratt
- Thermal Design of the High Brightness Thin LCDsD. ChestakovG. CenniniL. AlbaniS. Bonfiglio
- A High Performance and Cost Effective Molded Array Package SubstratePhilip E. RogrenPierangelo MagniMaura MazzolaMark ShawGiovanni GraziosiClaudio Maria Villa
- Advances in WLCSP Technologies to Enable Cost-ReductionRex AndersonR. ChilukuriB. RogersA. Syed
- Underfill Design for Low-k Dielectrics and Lead Free ApplicationsBrian SchmaltzYukinari AbeKazuyuki Kohara
- System Level Thermal Performance Evaluation of Inverted Exposed Pad PackagesVictor Chiriac
- 3D TSV Interposer Technology with Cu/SnAg Microbump InterconnectionsSeung Wook YoonDzafir ShariffJae Hun KuPandi Chelvam MarimuthuFlynn Carson
- Advanced SiP Packaging Technologies of IPD for Mobile ApplicationsGeun Sik KimKai LiuFlynn CarsonSeung Wook YoonMeenakshi Padmanathan
- A Review of Wafer Coating Methods for 3D PackagingSteven J. AdamsonJames KlockeGareth De Sanctis
- Thin Film Packaging Reinforcement for Overmolded MEMSGillot CharlotteJean-Louis PorninChristophe BillardEmannuelle LagouteMihel PellatGuy ParatNicolas Sillon
- Effect on Reliability of Bending Flexible CircuitsJohn DzarnoskiKexia Sun
- Next Generation System in a Package Manufacturing by Embedded Chip TechnologiesLars BoettcherA. OstmannD. ManessisS. KaraszkiewiczH. Reichl
- Localized Parylene-C Bonding for Micro Packaging and Cell Encapsulation using Reactive Multilayer FoilsXiaotun QiuDavid WelchJennifer Blain ChristenRui TangJie ZhuJonathon OilerCunjiang YuZiyu WangHongyu Yu
- Optimal Thermal Management of Microelectronic PackagesVictor Chiriac
- Integration of Electrografted Layers for the Metallization of Deep TSVsClaudio TruzziF. RaynalV. MevellecN. FrederichD. SuhrI. BispoB. Couturier
- Thermal Dissipation-It's Not Rocket ScienceFranklin WallSal Cassarino
- LED & HB-LED Packaging: Technology & Marketing TrendsJeff Perkins
- Contract Wafer Bumping of Compound SemiconductorsAndrew StrandjordThorsten TeutschAxel SchefflerBernd OttoJing Li
- TLP Bonding Technologies for Micro Joining and 3D PackagingKei MurayamaMitsuhiro AizawaMitsutoshi Higashi
- Passive Device Integration from Silicon TechnologyKai LiuYongTaek LeeHyunTai KimGwang KimGuruprasad BadakereYaojian LinBilly Ahn
- Journey Toward Process Convergence in TSV TechnologySesh RamaswamiJohn Dukovic
- Characterization of Wafer Level Metal Thermo-Compression BondingErkan CakmakBioh KimViorel Dragoi
- ZoneBOND™ Thin Wafer Support Process for Wafer Bonding ApplicationsJeremy McCutcheonRobert BrownJoElle Dachsteiner
- Flexible On-Chip Inductors and TransformerJames J. Wang
- Development of MEMS Power Sensor PackageBruce C. KimRahim Kasim
- Analysis of Silicon Micromachining by UV Lasers, and Implications for Full Cut Laser Dicing of Ultra-Thin Semiconductor Device WafersAndy HooperDaragh Finn
- Migration to FC in the Wireless Application Space and Associated ChallengesSteve Bezuk
- Enabling Thin Wafer Metal to Metal Bonding through Integration of High Temperature Polyimide Adhesives and Effective Copper Surface CleanersAnthony B. RardinSimon J. KirkMel P Zussmann
- Challenges Facing Resonant MEMS SensorsMichael Kranz
- Advanced TSV Copper Electrodeposition for 3D Interconnect ApplicationsRozalia BeicaPaul SiblerudDave Erickson
- Novel Polymeric Protective Coatings for Hydrofluoric Acid Vapor Etching during MEMS Release EtchTingji TangCurt PlanjeRamachandran K. TrichurXing-Fu ZhongShelly FowlerGu XuKimberly YessXie ShaoDaniel J. Vestyck
- No Flow Underfill Process Development for Fine Pitch Flip Chip Silicon to Silicon Wafer Level IntegrationZhaozhi LiJohn L. EvansPaul N. HoustonBrian J. LewisDaniel F. BaldwinSangil LeeTheodore G. TessierEugene A. Stout
- Via Last using Polymer Liners and their ReliabilityDeniz Sabuncuoglu TezcanBivragh MajeedYann CivalePhilippe SoussanEric Beyne
- A High-Sensitivity Resonant Sensor Realised Through the Exploitation of Nonlinear Dynamic BehaviourWilliam WaughB. J. GallacherJ. S. Burdess
- Aerosol Jet® Printing of High Density, 3-D Interconnects for Multi-Chip PackagingMichael J. RennBruce H. KingMichael O'ReillyJeff S. LealSuzette K. Pangrle
- The European 3D Technology Platform (e-CUBES)Peter RammArmin KlumppJosef WeberThomas FritzschMaaike TakloNicolas LietaerWalter De RaedtThierry HiltPascal CoudercChristian ValAlan MathewsonKafil M. RazeebFrank Stam
- Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing To Avoid Thin Wafer HandlingMel ZussmanChris MilasincicAnthony RardinSimon KirkT. Itabshi
- Enabling Wafer Level Processes for CIS ManufacturingEric F. PaboGarrett OakesRon MillerPaul LindnerGerald KreindlThorsten MatthiasV. DragoiM. Wimplinger
- Die-to-Wafer Bonding of Thin Dies using a 2-Step Approach; High Accuracy Placement, then Gang BondingGilbert LecarpentierRahul AgarwalWenqi ZhangParesh LimayeRiet LabieA. PhommahaxayP. Soussan
- Stacking of Known Good Rebuilt Wafers without TSV - Applications to Memories and SiPChristian ValPascal CoudercPierre Lartigues
- A Parametrically Amplified MEMS GyroscopeBarry J. GallacherZ. X. HuJ. S. BurdessK. M. Harish
- A Micromachined Robust Planar Triggered Sparkgap Switch for High Power Pulse ApplicationsThomas A. BaginskiRobert N. DeanEd J. Wild
- A Robust Wafer-Level Capping Approach for MEMS DevicesKrishnan SeetharamanBart van VelzenHans van ZadelhoffCadmus YuanFrank RietveldCoen TakJoost van BeekJan-Jaap KoningPeter H. C. MagnéeJohannes van WingerdenHerman C. W. Beijerinck
- Integration Aspects of the Implementation of Through Silicon Vias (TSV) for CMOS Image SensorsDave ThomasJean MichailosNicolas HotellierGilles MetellusFrancois GuyaderAlain InardKeith BuchananDorleta Cortaberria SanzYiping SongTony Wilby
- 3D Interconnect: The Challenges AheadBrandon Prior
- Electromigration Performance of WLPs with Standard and Polymer Core BallsL. NguyenH. NguyenA. Prabhu
- Electrolytic Solder Deposit for Next Generation Flip Chip Solder BumpingStephen KennySven LamprechtKai MatejatBernd Roelfs
- Direct Cu Wet Seed on Barrier of TSV WaferJianwen HanXuan LinYun ZhangJoseph AbyThierry Mourier
- Bimorph Diaphragm Formed by Two PZT Sheets on Micromachined Silicon for Sound GenerationYoungki ChoeShih-Jui ChenEun Sok Kim
- Micro IMU Utilizing Folded MEMS ApproachMontgomery C. RiversAlexander A. TrusovSergei A. ZotovAndrei M. Shkel
- A Comparison of Flip Chip Bump Electromigration Reliability for Cu Pillar, High Pb, SnAg, and SnPb Bump StructuresAhmer SyedKarthikeyan DhandapaniLou NichollsRobert MoodyC. J. BerryRobert Darveaux
- Implementing Fringing Field Sensors in PCB TechnologyRobert DeanAditi RaneColin StevensMichael BaginskiZane HartzogDavid Elton
- Wafer Level Packaging Cost ModelingChet A. Palesko
- PCBMEMS as a Flexible Path to Devices and Systems across Spatial ScalesDavid P. FriesStanislav Z. IvanovHeather BroadbentMatthew SmithGeorge SteimleRoss Willoughby
- Through Silicon Via Technology: Cost effective Cu-TSV Interconnects by EMC3D and Technical Challenges with Cu-TSVPaul SiblerudRozalia BeicaBioh KimErik Young
- Thermally Conductive (TC) Plastics in LED LampsRob JanssenIr. L. DouvenH. K. van Dijk
- Study of Thermo-Mechanical Reliability of TSV for 8-Layer Stacked Multi Chip PackageSung-Hoon ChoaJin Young ChoiCha Gyu SongHaeng Soo Lee
- High Directivity Couplers using Multilayer Organics (MLO)George WhiteMinu ValayilCharlie RussellSid Dalmia
- Underfill Induced Tensile Strain Ratcheting and its Effect on Flip Chip Solder Bump FatigueCraig D. HillmanRandy SchuellerGreg Caswell
- Polyamide 4T: A New Lead-Free Solderable Polymer Enabling Packaging Technology Through Micro Molding and LDSTamim Sidiki
- Boron Nitride in Thermoplastics (for LED Housings)Thomas RappeltChandrashekar Raman
- Fluidic Devices in PCB TechnologyMathias NowottnickLienhard PagelStefan Gassmann
- A New Wave of Innovation in Micro-Technology for Positioning, Navigation, and Timing (μPNT)Andrei M. Shkel
- Process Control for Wet Etching for Silicon Wafer ThinningLaura MauerHerman ItzkowitzJohn Taddei
- The Use of Metallographic and SEM Analysis for Characterization of Sidewall Surfaces in MEMS Devices with DRIE ProcessingLee LevineRobert DeanColin StevensSamuel Lawrence
- ENEP – A Cost-Effective Alternative for High Reliability Soldering ApplicationsGustavo RamosMustafa OezkoekSven LamprechtHugh Roberts
Harris, Daniel K., Robert Dean, Ashish Palkar, and Gary Wonacott. 2010. “High Flux Value Micro-Heat Pipe Arrays.” IMAPSource Proceedings 2010 (DPC): 1760–1807. https://doi.org/10.4071/2010DPC-wp21.