ISSN 2380-4505
Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
Die-to-Wafer Bonding of Thin Dies using a 2-Step Approach; High Accuracy Placement, then Gang Bonding
Die-to-Wafer Bonding of Thin Dies using a 2-Step Approach; High Accuracy Placement, then Gang Bonding
Gilbert Lecarpentier, Rahul Agarwal, Wenqi Zhang, Paresh Limaye, Riet Labie, A. Phommahaxay, P. Soussan,
Lecarpentier, Gilbert, Rahul Agarwal, Wenqi Zhang, Paresh Limaye, Riet Labie, A. Phommahaxay, and P. Soussan. 2010. “Die-to-Wafer Bonding of Thin Dies Using a 2-Step Approach; High Accuracy Placement, Then Gang Bonding.” IMAPSource Proceedings 2010 (DPC): 1254–81. https://doi.org/10.4071/2010DPC-wa14.