Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
Evaluation of Cu/Sn-Cu Bump Bonding Processes for 3D Integration Using a Fluxing Adhesive
Evaluation of Cu/Sn-Cu Bump Bonding Processes for 3D Integration Using a Fluxing Adhesive
Alan Huffman, Jason Reed, Matthew Lueck, Christopher Gregory, Dorota Temple, Russ Stapleton,
Huffman, Alan, Jason Reed, Matthew Lueck, Christopher Gregory, Dorota Temple, and Russ Stapleton. 2010. “Evaluation of Cu/Sn-Cu Bump Bonding Processes for 3D Integration Using a Fluxing Adhesive.” IMAPSource Proceedings 2010 (DPC): 1726–42. https://doi.org/10.4071/2010DPC-wp15.