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Device Packaging Conference Presentations
Vol. 2013, Issue DPC, 2013
January 01, 2013 EDT
Development of Embedded High Power Electronics Modules for Automotive Applications
Lars Boettcher
,
S. Karaszkiewicz
,
D. Manessis
,
A. Ostmann
,
embedded die
high power pcb
power semiconductor
•
https://doi.org/10.4071/2013DPC-wp35
IMAPSource Conference Papers
Boettcher, Lars, S. Karaszkiewicz, D. Manessis, and A. Ostmann. 2013. “Development of Embedded High Power Electronics Modules for Automotive Applications.”
IMAPSource Proceedings
2013 (DPC): 1717–43.
https://doi.org/10.4071/2013DPC-wp35
.
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