ISSN 2380-4505
Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT
Advancing Reliable High-Temperature Electronics through Compatible Material Interfaces
Advancing Reliable High-Temperature Electronics through Compatible Material Interfaces
Articles in Vol. 2022, Issue IMAPS Symposium, 2022
Vol. 2022, Issue IMAPS Symposium, 2022
- Mixed reaction gold as versatile plating solution for ENIG, ENEPIG and EPAG platingBritta SchafstellerMario RosinTimo SchlosserGustavo Ramos
- Eliminate Costly Component Out Of Pocket Defect Condition during Microelectronic Component Packaging/Shipping/HandlingRich RochfordCraig Blanchette
- Novel Micro-Textured Film Offers Promise in Universal Handling of 3D DevicesRaj VarmaJennifer Nunes
- Development of robust sensor packages for autonomous underwater vehiclesK.-F. BeckerM. VoitelD. SchützeT. D. NguyenM. SpanierO. HölckS. GottwaldA. HofmeisterL. KnieseR. BannaschT. BraunM. Schneider-Ramelow
- Board-Level Reliability of Lead-Frame Based Substrate and Surface Finishing TechnologyI.S. BaeHong Chan KimSung-Il KangSe Chuel ParkLarry MarcantiJohn MarkeRichard CoyleJoe Smetana
- Thick-film – a mature technology at the cutting edge of advances in the electronics industryGregory M. Berube
- New Packaging Technology for 2-dimensional VCSEL Arrays and Their Electro-Optical Performance and ApplicationsRainer DohleChristian NeumeyrMaximilian WallrodtGerold HenningThomas FriedricChristoph GréusJürgen RosskopfRobert Hohenleitner
- Open-Cavity Plastic Packages: A Robust IC Packaging Solution for High-Reliability ApplicationsSam SadriTom Tammen
- Heterogeneous Integration of III-V Lasers in a 300 mm CMOS Manufacturing LineSarah BaranowskiAnh NguyenMohammad Jobayer HossainSeth KrugerLewis G CarpenterAmit DikshitColin McDonoughDavid L. Harame
- The Study of Highest Thickness Photo Resist for Cu Post of Fan-Out Wafer Level PackagingYuseon HeoJiyoung LeeJieun ParkJunhyeong ParkJihye ShimSueryeon Kim
- Modeling the effect of hatched grounds on the radio-frequency performance of microstrip lines on flexible substrateMohamed Y. AbdelattyAshraf UmarAbdullah S. ObeidatEmuobosan EnakerakpoMohammed AlhendiMark. D. Poliks
- Additive Packaging for Bare Die and Additively Integrated AntennaChristopher AreiasEmily LamportYuri PiroMichael CasonCraig ArmientoAlkim Akyurtlu
- Innovations in Soldering Materials and Optimization of Solder Paste Printing and Inspection Parameters for System-in-Package AssemblyEvan GriffithCasey RowlandDavid SbiroliJonas Sjoberg
- Direct-Write Printed Wearable MetasurfacesAdria KajenskiGuinevere StrackShahriar KhushrushahiAlkim Akyurtlu
- Finding a Happy Medium for Heterogeneous Cache Integration using M-Series Fan-out TechnologyBenedict San JoseRobin DavisCraig BishopTim Olson
- Design of Wafer Level Solder Seals – A Surface Energy PerspectiveThomas F. MarinisJoseph W. Soucy
- Fabrication of Panel-Level Glass Substrates with Complete Design Freedom using LIDERafael SantosNils AnspachNorbert AmbrosiusStephan SchmidtRoman Ostholt
- A Novel Analytical Method of Thallium Determination in Gold ElectrodepositionPatrick SaittaJingjing WangEugene Shalyt
- Study on CPI behaviors of X Dimension Fan-Out Integration (XDFOI) packagesHaijie ChenZhen HuChen WangMing HeJielei XieYaojian LinChoon Heung Lee
- Thermal Performance of Liquid Metal Pastes Containing low Content of Metal Particles for Thermal Interface Materials in IC Module ElectronicsGuangyu FanJeff KurishSofia TagliaferriKyle GreenChristine LaBarbera
- Double Sided Integrated GaN Power Module with Double Pulse Test (DPT) VerificationSourish S. SinhaTzu-Hsuan ChengDr. Douglas C. Hopkins
- Design to cost Ag free silicon nitride AMB substrate for automotive power module applicationsHabib MustainAndré SchwöbelBenjamin FabianDaniel SchneeMiric Anton
- Smaller than MLCC: CCW (Ceramic Capacitor Wire)Soojae ParkJonghyun LeeChulhyung ChoNamhoon KimJaehoon KimSoomoon Park
- State-of-the-Art and Outlooks for 2.3D IC IntegrationJohn H Lau
- Heterogeneous Integration Hybrid Substrate with Ajinomoto Build-Up FilmChanning Cheng-Lin YangJohn H LauGary Chang-Fu ChenJones Yu-Cheng HuangAndy PengHsing-Ning LiuYH ChenTzyy-Jang Tseng
- A Hybrid Pressure-less Silver Sintering Technology for High-power Density ElectronicsYuan ZhaoBruno TollaDoug KatzeGlenda CastanedaJohn WoodJo-Anne WilsonDavid Brand
- Study for Bonding Technology by Electroplated Nano porous Cu StructureDaiki FuruyamaTakuma NakagawaJunta InoueKoji TatsumiSho NakagawaTakuma Katase
- Printed Microstrip Interconnects for Improved RF Performance in mm-Wave PackagingKurt ChristensonJustin BourassaJohn HamreMike Dean
- Simple Solution to Estimating and Predicting Transient Current in Small Signal AC CircuitsVirgil C. Ganescu, PhD
- An Organic Package Designer's Guide to Transitioning to FOWLP and 2.5D DesignBill Acito
- A Comprehensive Evaluation of Al Heavy Wire Bonding and Ribbon Bonding Application in high power WBG Power ModulesYang LiMustafeez HassanYuxuan WuAsif Imran EmonShiyue DengFang LuoAmol DeshpandeMichael McKeown
- Assembly Solutions for Cost-Effective Heterogeneous Integration with Disparate Die TypesGlenn Farris
- FEA Assisted Optimization of Bump Shear Test Method for Assessment of Back-End-of-Line Mechanical IntegrityMoon Soo LeeMin KimSungwon JungA-ram KangMyeong-soo YeoShinyoung ChungEun-cheol Lee
- Inspection Solution for 2μm RDL from Wafer-Level to Panel-Level Fan-out ProcessLeon LinAnderson LiuJay ChenMaruko WuCheolkyu KimZhuan Liu
- Influence of Rigid Carrier Substrate and its Release Layer on Warpage of Fan-out chip last WLPs & PLPsYoshinori MatsuuraTatsuya YoshidaYukiko KomiyaToshimi NakamuraTakenori YanaiKazuhiro OkuyamaYukiko KitabatakeRintaro IshiiKatsuyuki HayashiTakashi KubotaJoji Fujii
- A novel hybrid method to integrate delicate MEMS components into a FOWLPTanja BraunMarc DreissigackerMarkus WöhrmannKarl-Friedrich BeckerMartin Schneider-Ramelow
- Electrically Insulative Film Adhesive with Enhanced Thermal Performance to Assemble High Power Density Electronic DevicesYuan ZhaoBruno TollaDoug KatzeJohn WoodAna PreJunbo Gao
- A Novel Lead-Free Low-Temperature Solder Paste for Wafer-Level Package ApplicationHongwen ZhangTyler RichmondTybarius HarterDiego PradoJie GengHuaguang Wang
- Advancing Reliable High-Temperature Electronics through Compatible Material InterfacesJ. KupernikM. BakowskiN. ChiolinoM. BarlowB. DyerA. M. Francis
- Silicone Migration Risks and Mitigation in Thermal MaterialsSanjay Misra
- Novel Electroformed Ni-Au Alloy for High Temperature Semiconductor Test StructuresRobert D. HiltyEvgeniya Freydina
- Optimization of Additively Manufactured Interposers for DC and RF Applications in Printed Circuit BoardsEmily LamportAndrew LuceYuri PiroSusan TrulliAlkim Akyurtlu
- Modeling the effect of bend radius on the performance of a conformal dual-band mm-wave patch antenna arrayAshraf UmarMohamed Y. AbdelattyAbdullah ObeidatEmuobosan EnakerakpoMohammed AlhendiMark. D. Poliks
- The Science of Adhesion Insights to Understanding Adhesive PerformanceDouglas KatzeYuan ZhaoRose Roberts
- An Evaluation of Bath Life Effects on Photoresist Removal for Wafer Level PackagingJoel A. BahenaPhillip TylerJohn TaddeiMuthumanickam SankarapandianJamie PrudhommeKarthikeyan PillaiAbdullahi SaidChristopher CarrDario GoldfarbChris WaskiewiczQianwen Chen
- Wide process latitude, Pb-free low temperature co-fired ceramic (LTCC)Brian LaughlinAhmed SalahRussell AndersonYoung YoonBrad SchicklingMicromax™
- A Drop-in High-Temperature Pb-Free Solder Paste that Outperforms High-Pb Pastes in Power Discrete ApplicationsHongwen ZhangTyler RichmondSamuel LytwynecTybarius HarterDiego Prado
- Development of a Photopolymer-Based Dielectric Nanocomposite for High Resolution Direct-Write ProcessesYuri PiroChristopher AeriasAndrew LuceEmily LamportYibo LiSusan TrulliAlkim Akyurtlu
- Advancements, Versatility, and Flexibility of Dual-Layer Material System for Advanced Packaging ApplicationsAndy JonesDongshun BaiMatt KochLuke Prenger
- A Novel Printed Circuit Board Laminate for High Frequency ElectronicsJames LinGeraint OwenTim Orsley
- Assembly Technology for FO-MCM with HBM in HPC ApplicationShuai-Lin LiuNicholas KaoVito LinTeny ShihYu-Po Wang
- Maskless direct write lithography for 3D wafer-level-system-integrationFrank WindrichSven PreußAchim Jehle
- Development of all new structure of Dicing Die Attach Film (DDAF) for Stealth Dicing and Cool Expansion processesWataru IwayaYosuke SatoMisaki SakamotoMasanori YamagishiNaoya Saiki
- Electromigration Risk Assessment and Circuit Optimization using Innovative Multiphysics ModelingChongyang CaiZhi YangYuan LiPadam JainTerry KangKrishna Mellachervu
- On Excess CO2 within a Hermetically Sealed 14-Pin Butterfly Package: Solubility of CO2 within Fluorocarbon LiquidsMark M. De LunaTodd Uramoto
- A Physics-of-Failure Investigation of Flip Chip Reliability Based on Lead-Free Solder Fatigue ModelingSean BrinleeScott Popelar, Ph.D.
- Simulation and Experimental Study on Edge Bonding Shape for Reliable BGA PackagesYasuhiko KatoHiroyuki HamagamiTomoaki ShibataKohei SekiRyota Sato
- Investigation of electroless copper plating with high plating coverage in small BVH for next generation fine pattern SAPShinichiro YoshidaTomoharu NakayamaHisamitsu Yamamoto
- Microstructural Characterization of Sn57Bi1Ag Solder Alloy JointsSarangapani MuraliLim Yee Weon EvonneLo Miew WanBayaras Abito DanilaLoke Chee KeongLo Yee TingBalasubramanian Senthil KumarKang Sungsig SS
- A high-uniformity, high-purity copper pillar ECP process with limited acid concentrationPingping YeAdam LetizeJianwen HanStephan BrayeAshley KuppersmithKyle WhittenThomas RichardsonElie Najjar
- Dielectric Property Effect with Dielectric Constant for Millimeter Wave Antenna DesignChih-Yuan ShihChia Chu LaiYu-Po Wang
- A New Look at Silicon CarbideFrank Muscolino
- Understanding Criticality of Thermal Performance in Thermal Interface Material ApplicationsDr. Rita Mohanty
- Interfacial Diffusion Mechanism between ALD Al2O3 passivation/Cu in Direct Bonded Copper Substrate for Power ElectronicsKirak SonAesun OhBongmin JeongHyun-Cheol Bae
- Board Level Reliability of Flipchip PackageNishant LakheraMollie BensonAndrew Mawer
- Investigation of CuAl IMCs Corrosion in Chloride Environment and its Prevention StrategyJohn AlptekinEswar GopalakrishnanDinesh Kumar KumaravelKevin AntonyHannah LangerakOliver ChyanVarughese Mathew
- A Closed Form Method Combined with the Steinberg’s Solution to Estimate Number of Fatigue Cycles for Lead-Free SoldersTuan H. Nguyen
- Die-embedded packaging using Corning® multi-layered glassChoon-Kon KimYu XiaoJong-Min YookHyun-Je ChangHyung-Soo Moon
- Glass Substrate for Co-Packaged OpticsLars BrusbergAramais R. ZakharianJason R. GrenierBarry J. PaddockDaniel W. LevesqueCliff G. SuttonRobin M. ForceLucas W. YearyRobert A. BellmanChad C. TerwilligerBetsy J. Johnson
- Development of high performance flip chip ball grid array (FCBGA) packages for automotive application processorsGaurav SharmaNishant LakheraSandeep ShantaramWilly Huang
- Novel Temporary Bonding Film Adapted to Xenon Flash Lamp De-bonding System for FOWLP ApplicationHiroaki MatsubaraTomoaki ShibataYuta AkasuSaeko OgawaAyaka KurodaShogo Sobue
- Protected Wafer Level Chip Scale Packaging (P-WLCSP)Doug HacklerEd Prack PhD
- Reconfigurable NEMS based Advance Packaging for Anti Reverse Engineering and CounterfeitingAslam A. KhanKeon SahebkarRyan F. NeedMark M. TehranipoorNavid Asadizanjani
- Prevention of Cu Electrolytic Migration Defects on RDL by a Cu-Selective Passivation to Enhance ReliabilityAshish SalunkeJohn AlptekinKaushik AkulaSubiksha JayakumarShaurya KumarOliver Chyan
- Pre-applied underfill Technique for Fine-pitch Cu Pillar 3D Die Stacking to Enable 2.5/3D Advanced PackagingNicholas LayNicholas DiNapoliKaysar Rahim, PhD.Soheil Razmyar, PhD.Melissa Holliday
- Optimization of the Copper Microstructure to Improve Copper-to-Copper Direct BondingRalf SchmidtChristian SchwarzErkin TamerSascha Dieter
- Impact of FCBGA substrate stack-up on BLR performanceJaimal WilliamsonYutaka SuzukiRon Eller
- Electroplated Aluminum Pillars for Ultrasonic Flip Chip BondingS. BraunI. CirulisJ.E. LiedtkeK. HillerM. WiemerH. Kuhn
- Chiplet Integration by Die-to-Die Pillar-Suspended BridgeIchiro KonoShinji WakisakaToshiaki HirotaTakashi SaitouKen UkawaYoichiro Kurita
- High Robustness of Coated-Ag Wire BondingSarangapani MuraliLim Yee Weon EvonneDhayalan MariyappanLo Miew WanChong Mei Hoe JoanneBalasubramanian Senthil KumarKang Sungsig SS
- Insulated, Passivated & Adhesively-Promoted Bond Wire Using All-in-One Al2O3 CoatingSoojae ParkJonghyun LeeChulhyung ChoNamhoon KimYongje LeeSichun SeoManho KimYoungkwon YoonEulgi MinKyujung ChoiSang-Hoon LeeHong-Sik NamMonghyun ChoJeongtak Moon
- Digital Twins and Smart Manufacturing for Wire BondingBasil MiltonRay CathcartOdal KwonPavel ShusharinIvy Qin
- Metal Oxide Removal Using Atmospheric Pressure Plasma Technology for Electronic ApplicationsDaphne PappasAndrew SyRyan RobinsonRichard Burke
- Algorithm for Ultrasonic Wire Bond Outlier ClassificationPedro VillaHenri Seppänen
Kupernik, J., M. Bakowski, N. Chiolino, M. Barlow, B. Dyer, and A. M. Francis. 2023. “Advancing Reliable High-Temperature Electronics through Compatible Material Interfaces.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000076–000080. https://doi.org/10.4071/001c.74611.