ISSN 2380-4505
Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT
The Study of Highest Thickness Photo Resist for Cu Post of Fan-Out Wafer Level Packaging
The Study of Highest Thickness Photo Resist for Cu Post of Fan-Out Wafer Level Packaging
Articles in Vol. 2022, Issue IMAPS Symposium, 2022
Vol. 2022, Issue IMAPS Symposium, 2022
- Mixed reaction gold as versatile plating solution for ENIG, ENEPIG and EPAG platingBritta SchafstellerMario RosinTimo SchlosserGustavo Ramos
- Eliminate Costly Component Out Of Pocket Defect Condition during Microelectronic Component Packaging/Shipping/HandlingRich RochfordCraig Blanchette
- Novel Micro-Textured Film Offers Promise in Universal Handling of 3D DevicesRaj VarmaJennifer Nunes
- Development of robust sensor packages for autonomous underwater vehiclesK.-F. BeckerM. VoitelD. SchützeT. D. NguyenM. SpanierO. HölckS. GottwaldA. HofmeisterL. KnieseR. BannaschT. BraunM. Schneider-Ramelow
- Board-Level Reliability of Lead-Frame Based Substrate and Surface Finishing TechnologyI.S. BaeHong Chan KimSung-Il KangSe Chuel ParkLarry MarcantiJohn MarkeRichard CoyleJoe Smetana
- Thick-film – a mature technology at the cutting edge of advances in the electronics industryGregory M. Berube
- New Packaging Technology for 2-dimensional VCSEL Arrays and Their Electro-Optical Performance and ApplicationsRainer DohleChristian NeumeyrMaximilian WallrodtGerold HenningThomas FriedricChristoph GréusJürgen RosskopfRobert Hohenleitner
- Open-Cavity Plastic Packages: A Robust IC Packaging Solution for High-Reliability ApplicationsSam SadriTom Tammen
- Heterogeneous Integration of III-V Lasers in a 300 mm CMOS Manufacturing LineSarah BaranowskiAnh NguyenMohammad Jobayer HossainSeth KrugerLewis G CarpenterAmit DikshitColin McDonoughDavid L. Harame
- The Study of Highest Thickness Photo Resist for Cu Post of Fan-Out Wafer Level PackagingYuseon HeoJiyoung LeeJieun ParkJunhyeong ParkJihye ShimSueryeon Kim
- Modeling the effect of hatched grounds on the radio-frequency performance of microstrip lines on flexible substrateMohamed Y. AbdelattyAshraf UmarAbdullah S. ObeidatEmuobosan EnakerakpoMohammed AlhendiMark. D. Poliks
- Additive Packaging for Bare Die and Additively Integrated AntennaChristopher AreiasEmily LamportYuri PiroMichael CasonCraig ArmientoAlkim Akyurtlu
- Innovations in Soldering Materials and Optimization of Solder Paste Printing and Inspection Parameters for System-in-Package AssemblyEvan GriffithCasey RowlandDavid SbiroliJonas Sjoberg
- Direct-Write Printed Wearable MetasurfacesAdria KajenskiGuinevere StrackShahriar KhushrushahiAlkim Akyurtlu
- Finding a Happy Medium for Heterogeneous Cache Integration using M-Series Fan-out TechnologyBenedict San JoseRobin DavisCraig BishopTim Olson
- Design of Wafer Level Solder Seals – A Surface Energy PerspectiveThomas F. MarinisJoseph W. Soucy
- Fabrication of Panel-Level Glass Substrates with Complete Design Freedom using LIDERafael SantosNils AnspachNorbert AmbrosiusStephan SchmidtRoman Ostholt
- A Novel Analytical Method of Thallium Determination in Gold ElectrodepositionPatrick SaittaJingjing WangEugene Shalyt
- Study on CPI behaviors of X Dimension Fan-Out Integration (XDFOI) packagesHaijie ChenZhen HuChen WangMing HeJielei XieYaojian LinChoon Heung Lee
- Thermal Performance of Liquid Metal Pastes Containing low Content of Metal Particles for Thermal Interface Materials in IC Module ElectronicsGuangyu FanJeff KurishSofia TagliaferriKyle GreenChristine LaBarbera
- Double Sided Integrated GaN Power Module with Double Pulse Test (DPT) VerificationSourish S. SinhaTzu-Hsuan ChengDr. Douglas C. Hopkins
- Design to cost Ag free silicon nitride AMB substrate for automotive power module applicationsHabib MustainAndré SchwöbelBenjamin FabianDaniel SchneeMiric Anton
- Smaller than MLCC: CCW (Ceramic Capacitor Wire)Soojae ParkJonghyun LeeChulhyung ChoNamhoon KimJaehoon KimSoomoon Park
- State-of-the-Art and Outlooks for 2.3D IC IntegrationJohn H Lau
- Heterogeneous Integration Hybrid Substrate with Ajinomoto Build-Up FilmChanning Cheng-Lin YangJohn H LauGary Chang-Fu ChenJones Yu-Cheng HuangAndy PengHsing-Ning LiuYH ChenTzyy-Jang Tseng
- A Hybrid Pressure-less Silver Sintering Technology for High-power Density ElectronicsYuan ZhaoBruno TollaDoug KatzeGlenda CastanedaJohn WoodJo-Anne WilsonDavid Brand
- Study for Bonding Technology by Electroplated Nano porous Cu StructureDaiki FuruyamaTakuma NakagawaJunta InoueKoji TatsumiSho NakagawaTakuma Katase
- Printed Microstrip Interconnects for Improved RF Performance in mm-Wave PackagingKurt ChristensonJustin BourassaJohn HamreMike Dean
- Simple Solution to Estimating and Predicting Transient Current in Small Signal AC CircuitsVirgil C. Ganescu, PhD
- An Organic Package Designer's Guide to Transitioning to FOWLP and 2.5D DesignBill Acito
- A Comprehensive Evaluation of Al Heavy Wire Bonding and Ribbon Bonding Application in high power WBG Power ModulesYang LiMustafeez HassanYuxuan WuAsif Imran EmonShiyue DengFang LuoAmol DeshpandeMichael McKeown
- Assembly Solutions for Cost-Effective Heterogeneous Integration with Disparate Die TypesGlenn Farris
- FEA Assisted Optimization of Bump Shear Test Method for Assessment of Back-End-of-Line Mechanical IntegrityMoon Soo LeeMin KimSungwon JungA-ram KangMyeong-soo YeoShinyoung ChungEun-cheol Lee
- Inspection Solution for 2μm RDL from Wafer-Level to Panel-Level Fan-out ProcessLeon LinAnderson LiuJay ChenMaruko WuCheolkyu KimZhuan Liu
- Influence of Rigid Carrier Substrate and its Release Layer on Warpage of Fan-out chip last WLPs & PLPsYoshinori MatsuuraTatsuya YoshidaYukiko KomiyaToshimi NakamuraTakenori YanaiKazuhiro OkuyamaYukiko KitabatakeRintaro IshiiKatsuyuki HayashiTakashi KubotaJoji Fujii
- A novel hybrid method to integrate delicate MEMS components into a FOWLPTanja BraunMarc DreissigackerMarkus WöhrmannKarl-Friedrich BeckerMartin Schneider-Ramelow
- Electrically Insulative Film Adhesive with Enhanced Thermal Performance to Assemble High Power Density Electronic DevicesYuan ZhaoBruno TollaDoug KatzeJohn WoodAna PreJunbo Gao
- A Novel Lead-Free Low-Temperature Solder Paste for Wafer-Level Package ApplicationHongwen ZhangTyler RichmondTybarius HarterDiego PradoJie GengHuaguang Wang
- Advancing Reliable High-Temperature Electronics through Compatible Material InterfacesJ. KupernikM. BakowskiN. ChiolinoM. BarlowB. DyerA. M. Francis
- Silicone Migration Risks and Mitigation in Thermal MaterialsSanjay Misra
- Novel Electroformed Ni-Au Alloy for High Temperature Semiconductor Test StructuresRobert D. HiltyEvgeniya Freydina
- Optimization of Additively Manufactured Interposers for DC and RF Applications in Printed Circuit BoardsEmily LamportAndrew LuceYuri PiroSusan TrulliAlkim Akyurtlu
- Modeling the effect of bend radius on the performance of a conformal dual-band mm-wave patch antenna arrayAshraf UmarMohamed Y. AbdelattyAbdullah ObeidatEmuobosan EnakerakpoMohammed AlhendiMark. D. Poliks
- The Science of Adhesion Insights to Understanding Adhesive PerformanceDouglas KatzeYuan ZhaoRose Roberts
- An Evaluation of Bath Life Effects on Photoresist Removal for Wafer Level PackagingJoel A. BahenaPhillip TylerJohn TaddeiMuthumanickam SankarapandianJamie PrudhommeKarthikeyan PillaiAbdullahi SaidChristopher CarrDario GoldfarbChris WaskiewiczQianwen Chen
- Wide process latitude, Pb-free low temperature co-fired ceramic (LTCC)Brian LaughlinAhmed SalahRussell AndersonYoung YoonBrad SchicklingMicromax™
- A Drop-in High-Temperature Pb-Free Solder Paste that Outperforms High-Pb Pastes in Power Discrete ApplicationsHongwen ZhangTyler RichmondSamuel LytwynecTybarius HarterDiego Prado
- Development of a Photopolymer-Based Dielectric Nanocomposite for High Resolution Direct-Write ProcessesYuri PiroChristopher AeriasAndrew LuceEmily LamportYibo LiSusan TrulliAlkim Akyurtlu
- Advancements, Versatility, and Flexibility of Dual-Layer Material System for Advanced Packaging ApplicationsAndy JonesDongshun BaiMatt KochLuke Prenger
- A Novel Printed Circuit Board Laminate for High Frequency ElectronicsJames LinGeraint OwenTim Orsley
- Assembly Technology for FO-MCM with HBM in HPC ApplicationShuai-Lin LiuNicholas KaoVito LinTeny ShihYu-Po Wang
- Maskless direct write lithography for 3D wafer-level-system-integrationFrank WindrichSven PreußAchim Jehle
- Development of all new structure of Dicing Die Attach Film (DDAF) for Stealth Dicing and Cool Expansion processesWataru IwayaYosuke SatoMisaki SakamotoMasanori YamagishiNaoya Saiki
- Electromigration Risk Assessment and Circuit Optimization using Innovative Multiphysics ModelingChongyang CaiZhi YangYuan LiPadam JainTerry KangKrishna Mellachervu
- On Excess CO2 within a Hermetically Sealed 14-Pin Butterfly Package: Solubility of CO2 within Fluorocarbon LiquidsMark M. De LunaTodd Uramoto
- A Physics-of-Failure Investigation of Flip Chip Reliability Based on Lead-Free Solder Fatigue ModelingSean BrinleeScott Popelar, Ph.D.
- Simulation and Experimental Study on Edge Bonding Shape for Reliable BGA PackagesYasuhiko KatoHiroyuki HamagamiTomoaki ShibataKohei SekiRyota Sato
- Investigation of electroless copper plating with high plating coverage in small BVH for next generation fine pattern SAPShinichiro YoshidaTomoharu NakayamaHisamitsu Yamamoto
- Microstructural Characterization of Sn57Bi1Ag Solder Alloy JointsSarangapani MuraliLim Yee Weon EvonneLo Miew WanBayaras Abito DanilaLoke Chee KeongLo Yee TingBalasubramanian Senthil KumarKang Sungsig SS
- A high-uniformity, high-purity copper pillar ECP process with limited acid concentrationPingping YeAdam LetizeJianwen HanStephan BrayeAshley KuppersmithKyle WhittenThomas RichardsonElie Najjar
- Dielectric Property Effect with Dielectric Constant for Millimeter Wave Antenna DesignChih-Yuan ShihChia Chu LaiYu-Po Wang
- A New Look at Silicon CarbideFrank Muscolino
- Understanding Criticality of Thermal Performance in Thermal Interface Material ApplicationsDr. Rita Mohanty
- Interfacial Diffusion Mechanism between ALD Al2O3 passivation/Cu in Direct Bonded Copper Substrate for Power ElectronicsKirak SonAesun OhBongmin JeongHyun-Cheol Bae
- Board Level Reliability of Flipchip PackageNishant LakheraMollie BensonAndrew Mawer
- Investigation of CuAl IMCs Corrosion in Chloride Environment and its Prevention StrategyJohn AlptekinEswar GopalakrishnanDinesh Kumar KumaravelKevin AntonyHannah LangerakOliver ChyanVarughese Mathew
- A Closed Form Method Combined with the Steinberg’s Solution to Estimate Number of Fatigue Cycles for Lead-Free SoldersTuan H. Nguyen
- Die-embedded packaging using Corning® multi-layered glassChoon-Kon KimYu XiaoJong-Min YookHyun-Je ChangHyung-Soo Moon
- Glass Substrate for Co-Packaged OpticsLars BrusbergAramais R. ZakharianJason R. GrenierBarry J. PaddockDaniel W. LevesqueCliff G. SuttonRobin M. ForceLucas W. YearyRobert A. BellmanChad C. TerwilligerBetsy J. Johnson
- Development of high performance flip chip ball grid array (FCBGA) packages for automotive application processorsGaurav SharmaNishant LakheraSandeep ShantaramWilly Huang
- Novel Temporary Bonding Film Adapted to Xenon Flash Lamp De-bonding System for FOWLP ApplicationHiroaki MatsubaraTomoaki ShibataYuta AkasuSaeko OgawaAyaka KurodaShogo Sobue
- Protected Wafer Level Chip Scale Packaging (P-WLCSP)Doug HacklerEd Prack PhD
- Reconfigurable NEMS based Advance Packaging for Anti Reverse Engineering and CounterfeitingAslam A. KhanKeon SahebkarRyan F. NeedMark M. TehranipoorNavid Asadizanjani
- Prevention of Cu Electrolytic Migration Defects on RDL by a Cu-Selective Passivation to Enhance ReliabilityAshish SalunkeJohn AlptekinKaushik AkulaSubiksha JayakumarShaurya KumarOliver Chyan
- Pre-applied underfill Technique for Fine-pitch Cu Pillar 3D Die Stacking to Enable 2.5/3D Advanced PackagingNicholas LayNicholas DiNapoliKaysar Rahim, PhD.Soheil Razmyar, PhD.Melissa Holliday
- Optimization of the Copper Microstructure to Improve Copper-to-Copper Direct BondingRalf SchmidtChristian SchwarzErkin TamerSascha Dieter
- Impact of FCBGA substrate stack-up on BLR performanceJaimal WilliamsonYutaka SuzukiRon Eller
- Electroplated Aluminum Pillars for Ultrasonic Flip Chip BondingS. BraunI. CirulisJ.E. LiedtkeK. HillerM. WiemerH. Kuhn
- Chiplet Integration by Die-to-Die Pillar-Suspended BridgeIchiro KonoShinji WakisakaToshiaki HirotaTakashi SaitouKen UkawaYoichiro Kurita
- High Robustness of Coated-Ag Wire BondingSarangapani MuraliLim Yee Weon EvonneDhayalan MariyappanLo Miew WanChong Mei Hoe JoanneBalasubramanian Senthil KumarKang Sungsig SS
- Insulated, Passivated & Adhesively-Promoted Bond Wire Using All-in-One Al2O3 CoatingSoojae ParkJonghyun LeeChulhyung ChoNamhoon KimYongje LeeSichun SeoManho KimYoungkwon YoonEulgi MinKyujung ChoiSang-Hoon LeeHong-Sik NamMonghyun ChoJeongtak Moon
- Digital Twins and Smart Manufacturing for Wire BondingBasil MiltonRay CathcartOdal KwonPavel ShusharinIvy Qin
- Metal Oxide Removal Using Atmospheric Pressure Plasma Technology for Electronic ApplicationsDaphne PappasAndrew SyRyan RobinsonRichard Burke
- Algorithm for Ultrasonic Wire Bond Outlier ClassificationPedro VillaHenri Seppänen
Heo, Yuseon, Jiyoung Lee, Jieun Park, Junhyeong Park, Jihye Shim, and Sueryeon Kim. 2023. “The Study of Highest Thickness Photo Resist for Cu Post of Fan-Out Wafer Level Packaging.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000498–000501. https://doi.org/10.4071/001c.74539.