Printed Microstrip Interconnects for Improved RF Performance in mm-Wave Packaging

Kurt Christenson; Justin Bourassa; John Hamre; Mike Dean

doi:10.4071/001c.74593

Christenson, Kurt, Justin Bourassa, John Hamre, and Mike Dean. 2023. “Printed Microstrip Interconnects for Improved RF Performance in Mm-Wave Packaging.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000448–53. https://doi.org/10.4071/001c.74593.

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Printed Microstrip Interconnects for Improved RF Performance in mm-Wave Packaging

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