Interfacial Diffusion Mechanism between ALD Al2O3 passivation/Cu in Direct Bonded Copper Substrate for Power Electronics

Kirak Son; Aesun Oh; Bongmin Jeong; Hyun-Cheol Bae

doi:10.4071/001c.74740

Son, Kirak, Aesun Oh, Bongmin Jeong, and Hyun-Cheol Bae. 2023. “Interfacial Diffusion Mechanism between ALD Al2O3 Passivation/Cu in Direct Bonded Copper Substrate for Power Electronics.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000206–10. https://doi.org/10.4071/001c.74740.

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Interfacial Diffusion Mechanism between ALD Al2O3 passivation/Cu in Direct Bonded Copper Substrate for Power Electronics

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