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ISSN 2380-4505
Symposium Proceedings
Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT

Impact of FCBGA substrate stack-up on BLR performance

Jaimal Williamson, Yutaka Suzuki, Ron Eller,
Board level reliability (BLR)dielectric thicknessFlip chip ball grid array (FCBGA)substratewarpage
https://doi.org/10.4071/001c.74773
IMAPSource Conference Papers
Williamson, Jaimal, Yutaka Suzuki, and Ron Eller. 2023. “Impact of FCBGA Substrate Stack-up on BLR Performance.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000287–93. https:/​/​doi.org/​10.4071/​001c.74773.

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