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Symposium Proceedings
Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT

A Comprehensive Evaluation of Al Heavy Wire Bonding and Ribbon Bonding Application in high power WBG Power Modules

Yang Li, Mustafeez Hassan, Yuxuan Wu, Asif Imran Emon, Shiyue Deng, Fang Luo, Amol Deshpande, Michael McKeown,
WBG power moduleheavy Al wire and ribbonelectrical-thermal-mechanical Multiphysics evaluation
https://doi.org/10.4071/001c.74596
IMAPSource Conference Papers
Li, Yang, Mustafeez Hassan, Yuxuan Wu, Asif Imran Emon, Shiyue Deng, Fang Luo, Amol Deshpande, and Michael McKeown. 2023. “A Comprehensive Evaluation of Al Heavy Wire Bonding and Ribbon Bonding Application in High Power WBG Power Modules.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000010–000017. https:/​/​doi.org/​10.4071/​001c.74596.
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