Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT
Influence of Rigid Carrier Substrate and its Release Layer on Warpage of Fan-out chip last WLPs & PLPs
Influence of Rigid Carrier Substrate and its Release Layer on Warpage of Fan-out chip last WLPs & PLPs
Yoshinori Matsuura, Tatsuya Yoshida, Yukiko Komiya, Toshimi Nakamura, Takenori Yanai, Kazuhiro Okuyama, Yukiko Kitabatake, Rintaro Ishii, Katsuyuki Hayashi, Takashi Kubota, Joji Fujii,
Matsuura, Yoshinori, Tatsuya Yoshida, Yukiko Komiya, Toshimi Nakamura, Takenori Yanai, Kazuhiro Okuyama, Yukiko Kitabatake, et al. 2023. “Influence of Rigid Carrier Substrate and Its Release Layer on Warpage of Fan-out Chip Last WLPs & PLPs.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000043–000048. https://doi.org/10.4071/001c.74603.