ISSN 2380-4505
Vol. 2023, Issue Symposium, 2023February 23, 2024 EDT
Microstructure Evolution and Online Thermal Resistance of Ag Sintered SiC/DBA Power Module During Power Cycling
Microstructure Evolution and Online Thermal Resistance of Ag Sintered SiC/DBA Power Module During Power Cycling
Articles in Vol. 2023, Issue Symposium, 2023
Vol. 2023, Issue Symposium, 2023
- Transforming WLP Applications: Introducing Cutting-Edge Next-Generation Nanotwinned Copper Processes to Revolutionize Hybrid BondingPingping YeJianwen HanStephan BrayeKyle WhittenVeronica HayesHarshul KhannaAdam LetizeThomas RichardsonElie Najjar
- Thermal Performance and Reliability of Liquid Metal Pastes with Solid Metal Particles as Thermal Interface Materials for the Cooling of Computing ElectronicsGuangyu FanJeffrey KurishJohn LambJacob WicherWakerley BankerAlexander BonacciSofia TagliaferriKyle Green
- The Impact of AI on Contact Resistance and Its Suitability in Fine Pitch InterconnectsFee Li LieSathyanarayanan RaghavanEric PerfectoThomas WassickConor ThomasHeather PolgreanMuthumanickam SankarapandianCristina EstradaJennifer Oakley
- SiC Die Attach Based on Sintered for Wide Band Gap SemiconductorKoyo Kobori
- Rigorous Reliability Testing of an Encapsulated Thermal Pyrolytic Graphite (TPG) Heat Spreader for Passive Thermal Management ApplicationsJ. LeachM. GallaugherG. DouzosJ. FrankX. LiuD. LongworthD. KrenciszW. Fan
- Power Envelope Analyses of Chiplet Module and System-on-ChipEric OuyangXiao GuYonghyuk Jeong
- Package Assembly Design Kits - The Future of Advanced Package DesignRuben Fuentes
- Microstructure Evolution and Online Thermal Resistance of Ag Sintered SiC/DBA Power Module During Power CyclingFupeng HuoYe WangChuantong ChenZheng ZhangYoshiji YamaguchiNaoki WakasugiAiji SuetakeKatsuaki Suganuma
- Internal Bump Cracking Risk Assessment for Flip Chip Ball Grid Array Package During Board Level Reliability Test Through Finite Element AnalysisGuangxu LiSiva GurrumLi JiangRajen Murugan
- Influence of Interfacial Interaction Between Various Metal Substrates and Epoxies on Bonding Reliability Under High TempertureShuaijie ZhaoChuantong ChenMotoharu HagaMinoru UeshimaHirose SuzukiHiroto TakenakaKatsuaki Suganuma
- Glass-Core Substrates for RF Heterogeneous Integrated PackagesAndrew KettersonShuoqi ChenRajanish PandeyAnthony ChiuLidia El BouananiJohn HittYanghun YunYi Ram KimKevin AndersonKirk Ashby
- Evaluation of Upscaling the Selective Electrophoretic Deposition of Reduced Graphene Oxide on Miniaturized Au Interdigital Electrodes from Chip-to Wafer-LevelManuel BaeuscherMatthaeus HenkeKatrin HoeppnerPiotr MackowiakMichael SchifferMartin Schneider-Ramelow
- Enhancing Semiconductor Package Reliability through Mechanical Property Optimization of Pressureless Sintering Die Attach AdhesivesXuan HongBo XiaVincent PangLina BianXinpei CaoNoah EkstromJuliet SanchezEdward HoSelene HernandezQizhuo ZhuoRejoy Surendran
- Development of Printed Circuit Boards with High Thermal Conductivity and Low Thermal Expansion by Applying Cu-Mo Composite MaterialsYohei ItoKenjiro TakanishiTatsuya SakamotoKeisuke FujiwaraHitoshi Arai
- Development of Dicing Die Attach Film (DDAF) for Small DiesYutaro IshiiYuya TanakaMasanori YamagishiManabu MiyawakiNaoya Saiki
- Cost Analysis of Fan-out Processes for Chiplet PackagingAmy Palesko Lujan
- A Jettable and Dispensable Liquid Metal Paste as a Thermal Interface MaterialMilos Lazic
- Wafer Level Chip Size Package Integration of an Aero-acoustic MEMS Microphone into a Thin and Flexible SubstrateKolja ErbacherJoao Alves MarquesPiotr Mackowiak
- Using Outlier Control Technology with Feedforward Lithography to Address Die Shifting and Pattern Distortion Challenges in Fan-Out Panel-Level PackagingJohn ChangJian LuTimothy ChangKeith Best
- Unlocking the True Power of Additive Manufacturing for EMI ShieldingMarkus G. ScheibelMichael P. KaiserSutharsan BalasubramaniamMykola ChernobryvkoJulia-Marie KöszegiMarc DreissigackerMarius AdlerTanja BraunChuan I "Eric" HuangMeng "Jason" LiMuriel ThomasFranz Vollmann
- The Compliance Risk Assessment of EU REACH SVHC in Articles of IC Package by Studies of Analysis MethodologyRenata HsiaoFenny LiuWein ChenHan Gung ChenLiang-Yih HungYu Po Wang
- Study on the Manufacturability of XDFOI Package with Organic RDLs (XDFOI-O)Haijie ChenZiyao BianTao LiuJielei XieJingyu WuYaojian LinChoon Heung Lee
- Study on Chemical Activity of Electroless Copper PlatingI Hsuan ChouHuei Ting LaiYan Wen ChungWen Hung HuangMin Lung HuangYue Nung LinJen Kuang Fang
- Stress Analysis and Optimization on Saddle-shape Warpage by Direct Patterning of Stressed FilmSujie KangMin Soo HanJung Shin LeeKyeongbin LimBumki MoonDaniel Minwoo Rhee
- Stereolithographic Process for Embedding of Electronic Components into Multi-material Flexible and Stretchable Polymer Substrate to Reduce Stress During StretchingTobias TiedjeChristoph BräuerMarco LuniakKrzysztof NieweglowskiKarlheinz Bock
- Solder-less Fine Pitch Copper-to-Copper BondingNicholas LayKaysar Rahim
- Smart Metrology Control of Through Silicon Via Etching Process for High End DevicesDario AlliataGraham LynchMichael SchöbitzChong Fei TangSabri HammamiIsaac Ow
- Reliable Solder Columns to Replace Solder Balls in Large 2.5D Heterogeneous PackagesMartin Hart
- Reliability Prediction of Radiation Induced Failures in Semiconductor PackagesAshok AlagappanMasoud Rostami-Angas
- Optimized Die Preparation and Handling for High Yield Hybrid Die to Wafer BondingPieter BexAlain PhommahaxayKoen KennesSamuel SuhardSteven BremsEric Beyne
- Numerical Analysis of Narrow-gap Underfill Flow in the Flip-chip Process Using the Lattice Boltzmann MethodJung Shin LeeSujie KangDaniel Min Woo Rhee
- Next Level of 1/1 μm Line and Space Copper Redistribution Layer Fabrication with Organic Dielectric MaterialsYu ShojiTakuma NishimuraHisashi OgasawaraKeika HashimotoYuki MasudaHitoshi ArakiMasao Tomikawa
- Impact of Cu Protrusion on Connection Resistance in Hybrid Bonding of Via-middle TSV WaferNaoya WatanabeHiroshi YamamotoTakahiko Mitsui
- Exploration of Interfacial Materials Chemistry Control to Improve Cu Wire Bonding ReliabilityOliver ChyanKevin Antony Jesu DuraiDinesh Kumar KumaravelJohn AlptekinLogan EstridgeShyam Nair
- Electromigration of Power Devices Part 2: Power Device in Applications in Controlled EnvironmentHao ZhuangRobert BauerMilad MostofizadehJuliane Junesch
- Characterization of a UV-USP Laser Grooving Process Combined with Plasma Dicing to Support Next Generation Advanced Packaging TrendsRogier EvertsenJanet HopkinsOliver AnsellSamira KazemiRoland MumfordRichard BarnettKees BiesheuvelJeroen van Borkulo
- Assembly of Large Flip Chip Die in Ceramic PackagesK. GrahamJ. Ramirez RamosT. MarinisD. Hanson
- Addressing Die Displacement in Lithography Processes for Advanced Packaging ApplicationsSylvain I. MisatJeroen de BoeijChia-Ching HuangPeter van der KriekenMikhail LoktevYutai LeeMichiel van der Stam
- A Thermally Enhanced Film Adhesive for Assembling High Power Density Electronic DevicesYuan ZhaoDoug KatzeAna PreDerek WyattJosh SherwoodJaskaran Virdi
- A Comprehensive Study of Surface Finishes for High Frequency/High Speed ApplicationsFrank XuMartin BunceJim WatkowskiAnna LiftonRagu Raj RangarajuRommel Bumagat
- WLCSP Fully Protected Fan-In ReliabilityDoug HacklerEd Prack
- Trusted Data Acquisition in Microelectronics Manufacturing as a Basis for ML-Optimized ProcessingK. F. BeckerS. VogesP. FruehaufM. HeimannS. NerreterR. BlankM. ErdmannS. GottwaldA. HofmeisterP. LopuszanskiM. HesseM. ThiesS. MehrafsunR. FustE. BeckM. BecickaJ. PawlikowskiB. SchroederC. VoigtT. BraunM. Schneider-Ramelow
- Reliability Assessment of Indium Micro Bumps for 2.5D/3D Electronic Packaging through Cryo-Argon Milling TechniqueSoheil RazmyarNicholas LayKaysar Rahim
- Pressure-less Ag-Sinter: Necking, Pores Structure and Its PropertiesSarangapani MuraliLo Miew WanAudrey Long Wee SengAbito Danila BayarasJoanne Chong Mei HoeDennis Ang Kwang LeongKang Sungsig SS
- Optimizing Type 7 Solder Paster Formulation and Compatibility with Assembly Technology for Sub-75um System-in-Package ApplicationsEvan Griffith
- Investigating the Impact of Final Finishes on the Insertion Loss in As Received and After AgingBritta SchafstellerMichael SchwaemmleinMario RosinGustavo RamosZiad HatabMichael E. GadringerErich Schlaffer
- Gold Coated Silver Bonding Wire and Its Consistent Reliability PerformancesSarangapani MuraliDhayalan MariyappanTan Tze QingLoke Chee KeongBalasubramanian Senthil KumarKang Sungsig SS
- Development of Wafer Level Package Platform for High Reliability Crossover MCUsGaurav SharmaMeng Yao SuVarun ThukralCraig BeddingfieldNishant Lakhera
- Conformal Silver Films for EMI Shielding of SiP ArchitecturesEmma E. PawliczakPaul R. Chiarot
- Cleaning and Particle Challenges in the Temporary Bonding and Debonding ProcessJoel A. BahenaHunter JonesKevin DonnellyJohn TaddeiPhillip TylerAmit KumarJohn MasseySeth MolenhourYongqing Jiang
- Board Level Reliability Testing of RF PackagesMumtaz Y. Bora
- Automotive Grade WLCSP for Radar ApplicationsNishant LakheraBurt CarpenterTeck Beng LauAndrew J. Mawer
- Al2O3-Coated Bonding Wire with Electrical Insulation & Promoted AdhesionSoojae ParkHwajin JeongSichun SeoChulhyung Cho
- Adhesive Solutions for Closed Cavity PackagingPatrick SchirmerSeverin Ringelstetter
Huo, Fupeng, Ye Wang, Chuantong Chen, Zheng Zhang, Yoshiji Yamaguchi, Naoki Wakasugi, Aiji Suetake, and Katsuaki Suganuma. 2024. “Microstructure Evolution and Online Thermal Resistance of Ag Sintered SiC/DBA Power Module During Power Cycling.” IMAPSource Proceedings 2023 (Symposium): 60–64. https://doi.org/10.4071/001c.94309.