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ISSN 2380-4505
Symposium Proceedings
Vol. 2023, Issue Symposium, 2023February 29, 2024 EDT

Study on Chemical Activity of Electroless Copper Plating

I Hsuan Chou, Huei Ting Lai, Yan Wen Chung, Wen Hung Huang, Min Lung Huang, Yue Nung Lin, Jen Kuang Fang,
Electroless copper platingPd/Sn clusterchemical activityplating efficiency
https://doi.org/10.4071/001c.94476
IMAPSource Conference Papers
Chou, I Hsuan, Huei Ting Lai, Yan Wen Chung, Wen Hung Huang, Min Lung Huang, Yue Nung Lin, and Jen Kuang Fang. 2024. “Study on Chemical Activity of Electroless Copper Plating.” IMAPSource Proceedings 2023 (Symposium): 102–6. https:/​/​doi.org/​10.4071/​001c.94476.

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