ISSN 2380-4505
Vol. 2023, Issue Symposium, 2023February 23, 2024 EDT
Package Assembly Design Kits - The Future of Advanced Package Design
Package Assembly Design Kits - The Future of Advanced Package Design
Package Assembly Design Kit (PADK)High-Density Fan-Out (HDFO)Wafer Level Packaging (WLP)Outsourced Semiconductor Assembly and Test (OSAT)Electronic Design Automation (EDA)Redistribution Layer (RDL)Design Rule Checks (DRC)Design VerificationComputer-Aided Manufacturing (CAM)Computer-Aided Design (CAD)
Fuentes, Ruben. 2024. “Package Assembly Design Kits - The Future of Advanced Package Design.” IMAPSource Proceedings 2023 (Symposium): 5–8. https://doi.org/10.4071/001c.94294.