Vol. 2023, Issue Symposium, 2023February 29, 2024 EDT
Wafer Level Chip Size Package Integration of an Aero-acoustic MEMS Microphone into a Thin and Flexible Substrate
Wafer Level Chip Size Package Integration of an Aero-acoustic MEMS Microphone into a Thin and Flexible Substrate
Erbacher, Kolja, Joao Alves Marques, and Piotr Mackowiak. 2024. “Wafer Level Chip Size Package Integration of an Aero-Acoustic MEMS Microphone into a Thin and Flexible Substrate.” IMAPSource Proceedings 2023 (Symposium): 201–4. https://doi.org/10.4071/001c.94495.