Development of Wafer Level Package Platform for High Reliability Crossover MCUs

Sharma, Gaurav, Meng Yao Su, Varun Thukral, Craig Beddingfield, and Nishant Lakhera. 2024. “Development of Wafer Level Package Platform for High Reliability Crossover MCUs.” IMAPSource Proceedings 2023 (Symposium): 266–72. https:/​/​doi.org/​10.4071/​001c.94511.