ISSN 2380-4505
Vol. 2023, Issue Symposium, 2023February 29, 2024 EDT
Using Outlier Control Technology with Feedforward Lithography to Address Die Shifting and Pattern Distortion Challenges in Fan-Out Panel-Level Packaging
Using Outlier Control Technology with Feedforward Lithography to Address Die Shifting and Pattern Distortion Challenges in Fan-Out Panel-Level Packaging
Chang, John, Jian Lu, Timothy Chang, and Keith Best. 2024. “Using Outlier Control Technology with Feedforward Lithography to Address Die Shifting and Pattern Distortion Challenges in Fan-Out Panel-Level Packaging.” IMAPSource Proceedings 2023 (Symposium): 195–200. https://doi.org/10.4071/001c.94494.