A Thermally Enhanced Film Adhesive for Assembling High Power Density Electronic Devices

Yuan Zhao; Doug Katze; Ana Pre; Derek Wyatt; Josh Sherwood; Jaskaran Virdi

doi:10.4071/001c.94480

Zhao, Yuan, Doug Katze, Ana Pre, Derek Wyatt, Josh Sherwood, and Jaskaran Virdi. 2024. “A Thermally Enhanced Film Adhesive for Assembling High Power Density Electronic Devices.” IMAPSource Proceedings 2023 (Symposium): 139–43. https://doi.org/10.4071/001c.94480.

View more stats