ISSN 2380-4505
Vol. 2023, Issue Symposium, 2023February 23, 2024 EDT
Power Envelope Analyses of Chiplet Module and System-on-Chip
Power Envelope Analyses of Chiplet Module and System-on-Chip
Articles in Vol. 2023, Issue Symposium, 2023
Vol. 2023, Issue Symposium, 2023
- Transforming WLP Applications: Introducing Cutting-Edge Next-Generation Nanotwinned Copper Processes to Revolutionize Hybrid BondingPingping YeJianwen HanStephan BrayeKyle WhittenVeronica HayesHarshul KhannaAdam LetizeThomas RichardsonElie Najjar
- Thermal Performance and Reliability of Liquid Metal Pastes with Solid Metal Particles as Thermal Interface Materials for the Cooling of Computing ElectronicsGuangyu FanJeffrey KurishJohn LambJacob WicherWakerley BankerAlexander BonacciSofia TagliaferriKyle Green
- The Impact of AI on Contact Resistance and Its Suitability in Fine Pitch InterconnectsFee Li LieSathyanarayanan RaghavanEric PerfectoThomas WassickConor ThomasHeather PolgreanMuthumanickam SankarapandianCristina EstradaJennifer Oakley
- SiC Die Attach Based on Sintered for Wide Band Gap SemiconductorKoyo Kobori
- Rigorous Reliability Testing of an Encapsulated Thermal Pyrolytic Graphite (TPG) Heat Spreader for Passive Thermal Management ApplicationsJ. LeachM. GallaugherG. DouzosJ. FrankX. LiuD. LongworthD. KrenciszW. Fan
- Power Envelope Analyses of Chiplet Module and System-on-ChipEric OuyangXiao GuYonghyuk Jeong
- Package Assembly Design Kits - The Future of Advanced Package DesignRuben Fuentes
- Microstructure Evolution and Online Thermal Resistance of Ag Sintered SiC/DBA Power Module During Power CyclingFupeng HuoYe WangChuantong ChenZheng ZhangYoshiji YamaguchiNaoki WakasugiAiji SuetakeKatsuaki Suganuma
- Internal Bump Cracking Risk Assessment for Flip Chip Ball Grid Array Package During Board Level Reliability Test Through Finite Element AnalysisGuangxu LiSiva GurrumLi JiangRajen Murugan
- Influence of Interfacial Interaction Between Various Metal Substrates and Epoxies on Bonding Reliability Under High TempertureShuaijie ZhaoChuantong ChenMotoharu HagaMinoru UeshimaHirose SuzukiHiroto TakenakaKatsuaki Suganuma
- Glass-Core Substrates for RF Heterogeneous Integrated PackagesAndrew KettersonShuoqi ChenRajanish PandeyAnthony ChiuLidia El BouananiJohn HittYanghun YunYi Ram KimKevin AndersonKirk Ashby
- Evaluation of Upscaling the Selective Electrophoretic Deposition of Reduced Graphene Oxide on Miniaturized Au Interdigital Electrodes from Chip-to Wafer-LevelManuel BaeuscherMatthaeus HenkeKatrin HoeppnerPiotr MackowiakMichael SchifferMartin Schneider-Ramelow
- Enhancing Semiconductor Package Reliability through Mechanical Property Optimization of Pressureless Sintering Die Attach AdhesivesXuan HongBo XiaVincent PangLina BianXinpei CaoNoah EkstromJuliet SanchezEdward HoSelene HernandezQizhuo ZhuoRejoy Surendran
- Development of Printed Circuit Boards with High Thermal Conductivity and Low Thermal Expansion by Applying Cu-Mo Composite MaterialsYohei ItoKenjiro TakanishiTatsuya SakamotoKeisuke FujiwaraHitoshi Arai
- Development of Dicing Die Attach Film (DDAF) for Small DiesYutaro IshiiYuya TanakaMasanori YamagishiManabu MiyawakiNaoya Saiki
- Cost Analysis of Fan-out Processes for Chiplet PackagingAmy Palesko Lujan
- A Jettable and Dispensable Liquid Metal Paste as a Thermal Interface MaterialMilos Lazic
- Wafer Level Chip Size Package Integration of an Aero-acoustic MEMS Microphone into a Thin and Flexible SubstrateKolja ErbacherJoao Alves MarquesPiotr Mackowiak
- Using Outlier Control Technology with Feedforward Lithography to Address Die Shifting and Pattern Distortion Challenges in Fan-Out Panel-Level PackagingJohn ChangJian LuTimothy ChangKeith Best
- Unlocking the True Power of Additive Manufacturing for EMI ShieldingMarkus G. ScheibelMichael P. KaiserSutharsan BalasubramaniamMykola ChernobryvkoJulia-Marie KöszegiMarc DreissigackerMarius AdlerTanja BraunChuan I "Eric" HuangMeng "Jason" LiMuriel ThomasFranz Vollmann
- The Compliance Risk Assessment of EU REACH SVHC in Articles of IC Package by Studies of Analysis MethodologyRenata HsiaoFenny LiuWein ChenHan Gung ChenLiang-Yih HungYu Po Wang
- Study on the Manufacturability of XDFOI Package with Organic RDLs (XDFOI-O)Haijie ChenZiyao BianTao LiuJielei XieJingyu WuYaojian LinChoon Heung Lee
- Study on Chemical Activity of Electroless Copper PlatingI Hsuan ChouHuei Ting LaiYan Wen ChungWen Hung HuangMin Lung HuangYue Nung LinJen Kuang Fang
- Stress Analysis and Optimization on Saddle-shape Warpage by Direct Patterning of Stressed FilmSujie KangMin Soo HanJung Shin LeeKyeongbin LimBumki MoonDaniel Minwoo Rhee
- Stereolithographic Process for Embedding of Electronic Components into Multi-material Flexible and Stretchable Polymer Substrate to Reduce Stress During StretchingTobias TiedjeChristoph BräuerMarco LuniakKrzysztof NieweglowskiKarlheinz Bock
- Solder-less Fine Pitch Copper-to-Copper BondingNicholas LayKaysar Rahim
- Smart Metrology Control of Through Silicon Via Etching Process for High End DevicesDario AlliataGraham LynchMichael SchöbitzChong Fei TangSabri HammamiIsaac Ow
- Reliable Solder Columns to Replace Solder Balls in Large 2.5D Heterogeneous PackagesMartin Hart
- Reliability Prediction of Radiation Induced Failures in Semiconductor PackagesAshok AlagappanMasoud Rostami-Angas
- Optimized Die Preparation and Handling for High Yield Hybrid Die to Wafer BondingPieter BexAlain PhommahaxayKoen KennesSamuel SuhardSteven BremsEric Beyne
- Numerical Analysis of Narrow-gap Underfill Flow in the Flip-chip Process Using the Lattice Boltzmann MethodJung Shin LeeSujie KangDaniel Min Woo Rhee
- Next Level of 1/1 μm Line and Space Copper Redistribution Layer Fabrication with Organic Dielectric MaterialsYu ShojiTakuma NishimuraHisashi OgasawaraKeika HashimotoYuki MasudaHitoshi ArakiMasao Tomikawa
- Impact of Cu Protrusion on Connection Resistance in Hybrid Bonding of Via-middle TSV WaferNaoya WatanabeHiroshi YamamotoTakahiko Mitsui
- Exploration of Interfacial Materials Chemistry Control to Improve Cu Wire Bonding ReliabilityOliver ChyanKevin Antony Jesu DuraiDinesh Kumar KumaravelJohn AlptekinLogan EstridgeShyam Nair
- Electromigration of Power Devices Part 2: Power Device in Applications in Controlled EnvironmentHao ZhuangRobert BauerMilad MostofizadehJuliane Junesch
- Characterization of a UV-USP Laser Grooving Process Combined with Plasma Dicing to Support Next Generation Advanced Packaging TrendsRogier EvertsenJanet HopkinsOliver AnsellSamira KazemiRoland MumfordRichard BarnettKees BiesheuvelJeroen van Borkulo
- Assembly of Large Flip Chip Die in Ceramic PackagesK. GrahamJ. Ramirez RamosT. MarinisD. Hanson
- Addressing Die Displacement in Lithography Processes for Advanced Packaging ApplicationsSylvain I. MisatJeroen de BoeijChia-Ching HuangPeter van der KriekenMikhail LoktevYutai LeeMichiel van der Stam
- A Thermally Enhanced Film Adhesive for Assembling High Power Density Electronic DevicesYuan ZhaoDoug KatzeAna PreDerek WyattJosh SherwoodJaskaran Virdi
- A Comprehensive Study of Surface Finishes for High Frequency/High Speed ApplicationsFrank XuMartin BunceJim WatkowskiAnna LiftonRagu Raj RangarajuRommel Bumagat
- WLCSP Fully Protected Fan-In ReliabilityDoug HacklerEd Prack
- Trusted Data Acquisition in Microelectronics Manufacturing as a Basis for ML-Optimized ProcessingK. F. BeckerS. VogesP. FruehaufM. HeimannS. NerreterR. BlankM. ErdmannS. GottwaldA. HofmeisterP. LopuszanskiM. HesseM. ThiesS. MehrafsunR. FustE. BeckM. BecickaJ. PawlikowskiB. SchroederC. VoigtT. BraunM. Schneider-Ramelow
- Reliability Assessment of Indium Micro Bumps for 2.5D/3D Electronic Packaging through Cryo-Argon Milling TechniqueSoheil RazmyarNicholas LayKaysar Rahim
- Pressure-less Ag-Sinter: Necking, Pores Structure and Its PropertiesSarangapani MuraliLo Miew WanAudrey Long Wee SengAbito Danila BayarasJoanne Chong Mei HoeDennis Ang Kwang LeongKang Sungsig SS
- Optimizing Type 7 Solder Paster Formulation and Compatibility with Assembly Technology for Sub-75um System-in-Package ApplicationsEvan Griffith
- Investigating the Impact of Final Finishes on the Insertion Loss in As Received and After AgingBritta SchafstellerMichael SchwaemmleinMario RosinGustavo RamosZiad HatabMichael E. GadringerErich Schlaffer
- Gold Coated Silver Bonding Wire and Its Consistent Reliability PerformancesSarangapani MuraliDhayalan MariyappanTan Tze QingLoke Chee KeongBalasubramanian Senthil KumarKang Sungsig SS
- Development of Wafer Level Package Platform for High Reliability Crossover MCUsGaurav SharmaMeng Yao SuVarun ThukralCraig BeddingfieldNishant Lakhera
- Conformal Silver Films for EMI Shielding of SiP ArchitecturesEmma E. PawliczakPaul R. Chiarot
- Cleaning and Particle Challenges in the Temporary Bonding and Debonding ProcessJoel A. BahenaHunter JonesKevin DonnellyJohn TaddeiPhillip TylerAmit KumarJohn MasseySeth MolenhourYongqing Jiang
- Board Level Reliability Testing of RF PackagesMumtaz Y. Bora
- Automotive Grade WLCSP for Radar ApplicationsNishant LakheraBurt CarpenterTeck Beng LauAndrew J. Mawer
- Al2O3-Coated Bonding Wire with Electrical Insulation & Promoted AdhesionSoojae ParkHwajin JeongSichun SeoChulhyung Cho
- Adhesive Solutions for Closed Cavity PackagingPatrick SchirmerSeverin Ringelstetter
Ouyang, Eric, Xiao Gu, and Yonghyuk Jeong. 2024. “Power Envelope Analyses of Chiplet Module and System-on-Chip.” IMAPSource Proceedings 2023 (Symposium): 14–20. https://doi.org/10.4071/001c.94297.