Power Envelope Analyses of Chiplet Module and System-on-Chip

Ouyang, Eric, Xiao Gu, and Yonghyuk Jeong. 2024. “Power Envelope Analyses of Chiplet Module and System-on-Chip.” IMAPSource Proceedings 2023 (Symposium): 14–20. https:/​/​doi.org/​10.4071/​001c.94297.