Assembly of Large Flip Chip Die in Ceramic Packages

Graham, K., J. Ramirez Ramos, T. Marinis, and D. Hanson. 2024. “Assembly of Large Flip Chip Die in Ceramic Packages.” IMAPSource Proceedings 2023 (Symposium): 120–38. https:/​/​doi.org/​10.4071/​001c.94479.