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Device Packaging Conference Presentations
Vol. 2014, Issue DPC, 2014January 01, 2014 EDT

Enabling Resist Processing Technologies for Advanced Packaging

Antun Peic, Thorsten Matthias, Johanna Bartl, Paul Lindner,
NanoSprayConformal Photoresist CoatingTSV
https://doi.org/10.4071/2014DPC-tp22
IMAPSource Conference Papers
Peic, Antun, Thorsten Matthias, Johanna Bartl, and Paul Lindner. 2014. “Enabling Resist Processing Technologies for Advanced Packaging.” IMAPSource Proceedings 2014 (DPC): 830–62. https:/​/​doi.org/​10.4071/​2014DPC-tp22.
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