Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
Damage Induced in Interconnect Structures Mimicking Stresses During Flip Chip Packaging
Damage Induced in Interconnect Structures Mimicking Stresses During Flip Chip Packaging
Ibon Ocana,
Ocana, Ibon. 2014. “Damage Induced in Interconnect Structures Mimicking Stresses During Flip Chip Packaging.” IMAPSource Proceedings 2014 (DPC): 479–500. https://doi.org/10.4071/2014DPC-ta21.