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Device Packaging Conference Presentations
Vol. 2014, Issue DPC, 2014January 01, 2014 EDT

Adhesive Enabling Technology for Directly Plating Copper onto Glass

Lutz Brandt, Zhiming Liu, Hailuo Fu, Sara Hunegnaw, Tafadzwa Magaya,
glass substratemetallizationadhesion
https://doi.org/10.4071/2014DPC-tha12
IMAPSource Conference Papers
Brandt, Lutz, Zhiming Liu, Hailuo Fu, Sara Hunegnaw, and Tafadzwa Magaya. 2014. “Adhesive Enabling Technology for Directly Plating Copper onto Glass.” IMAPSource Proceedings 2014 (DPC): 1913–36. https:/​/​doi.org/​10.4071/​2014DPC-tha12.
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