Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
Patterned Permanent Bonding of Benzocyclobutene Based Dielectric Materials for Advanced Wafer Level Packaging
Patterned Permanent Bonding of Benzocyclobutene Based Dielectric Materials for Advanced Wafer Level Packaging
Jong-Uk Kim, Anupam Choubey, Rosemary Bell, Hua Dong, Michael Gallagher, Joe Lachowski, Masaki Kondo, Corey O'Connor, Greg Prokopowicz, Bob Barr, Dow Electronic Materials, Kai Zoschke, Matthias Wegner, Christina Lopper, Michael Toepper, Fraunhofer IZM,
Kim, Jong-Uk, Anupam Choubey, Rosemary Bell, Hua Dong, Michael Gallagher, Joe Lachowski, Masaki Kondo, et al. 2014. “Patterned Permanent Bonding of Benzocyclobutene Based Dielectric Materials for Advanced Wafer Level Packaging.” IMAPSource Proceedings 2014 (DPC): 886–912. https://doi.org/10.4071/2014DPC-tp24.