ISSN 2380-4505
Articles in Vol. 2014, Issue DPC, 2014
Vol. 2014, Issue DPC, 2014
- A Current-Controlled PCB Integrated MEMS Tilt MirrorRobert N. DeanColin B. StevensJohn J. Tatarchuk
- Cost Comparison of Temporary Bond and Debond Methods For Thin Wafer HandlingAmy PaleskoChet Palesko
- Manufacturing Readiness of BVA(TM) Technology for Fine-Pitch Package-on-PackageWael ZohniRajesh KatkarRey CoRizza Cizek
- Packaging Materials for Flip Chip and WLP: Underfill Design Using FEM for FC-BGA, FC-CSP, and Moving Towards 2.5/3D.Brian SchmaltzYukinari AbeKazuyuki Kohara
- Reverse Engineering for the Purpose of Intellectual Property Protection and Accelerated Product Development in SOC and SIP StructuresLajos (Louis) BurgyanYuji Kakizaki
- MEMS- Based Cryogenic Coolers - Micro Joule - Thomson Cryogenic CoolersYunda WangYC Lee
- A PCB Technology Moisture Content and Electrical Conductivity Sensor Probe for Agricultural and Horticultural ApplicationsRobert N. DeanElizabeth GuertalAdam NewbyGlenn Fain
- Thermal Aging of Optically SiliconesMichelle VelderrainMichelle Poliskie
- Non-Conductive Film (NCF) with No Voiding and High ReliabilityEdgardo AnzuresAnupam ChoubeyAvin DhobleDavid FlemingRobert BarrJeffrey CalvertJoon-Seok Oh
- 2.5D and 3D Integration Technology UpdateRobert Patti
- Mobile Packaging and Interconnect TrendsBrandon Prior
- High Throughput Thin Wafer Support Technology for 3DICJohn MooreJared PettitDavid YoungAlman Law
- Challenges and Directions in Mobile Device PackagingSteve Bezuk
- ARM Dual Core Product Demonstration with 2.5D Through-Silicon-Via (TSV)Michael KellyRick Reed
- Electrical Performance Comparison between fcBGA and eWLB PackagesKai LiuYongTaek LeeHyunTai KimMaPhooPwint HlaingGwang. KimSusan ParkBilly Ahn
- Metrology and Inspection for New Interconnects in Advanced PackagingRuss DudleyMatt WilsonRajiv Roy
- A Decade of High Accuracy Die Attach Equipment and Process Developments (Addressing Photonics Device Packaging Challenges)Johann WeinhaendlerRudolf KaiserHardy Kellermann
- Temporary Bonding Cost Of Ownership: The link between low total thickness variation and chip yieldThomas UhrmannJürgen BurggrafHarald WiesbauerJulian BravinThorsten MatthiasMarkus WimplingerPaul LindnerHerman MeynenYann CivaleRanjith JohnSheng WangPeng-Fei FuCraig YeakleGary Aw
- Use of Darkfield Laser Technology in Monitoring Particles Generated by Process Tools in Cu Pillar Bumping & Wafer Edge InspectionReza Asgari
- Optimization of Lead Free Plating for Flip Chip ApplicationsCharles L. ArvinJurg StahlWolfgang SauterHarry coxEric PerfectoValerie ObersonNathalie Normand
- Pathfinding and Design Optimization of 2.5D/3D devices in the context of multiple PCBsFarhang YazdaniJohn Park
- Adhesive Enabling Technology for Direct Metal Deposition on Molding ResinKenichiroh MukaiKwonil KimBrian EastepLee GahertyAnirudh KashyapLutz Brandt
- Patterned Permanent Bonding of Benzocyclobutene Based Dielectric Materials for Advanced Wafer Level PackagingJong-Uk KimAnupam ChoubeyRosemary BellHua DongMichael GallagherJoe LachowskiMasaki KondoCorey O'ConnorGreg ProkopowiczBob BarrDow Electronic MaterialsKai ZoschkeMatthias WegnerChristina LopperMichael ToepperFraunhofer IZM
- Present and Future Applications of MEMS for Automotive IndustryThibault Buisson
- TSV technology embedding high density capacitors for Advanced 3D packaging solutionsCatherine BunelFlorent Lallemand
- A New Type of TSV Defect Caused by BMD in Silicon SubstrateDingyou ZhangSarasvathi ThangarajuDaniel SmithHimani KamineniChristian KlewerMark ScholefieldMing LeiTong Qing ChenKumarapuram GopalakrishnanAbhishek VikramVictor LimWonwoo KimRamakanth Alapati
- Adhesive Enabling Technology for Directly Plating Copper onto GlassLutz BrandtZhiming LiuHailuo FuSara HunegnawTafadzwa Magaya
- Embedding Active and Passive Devices in Medical ElectronicsJohn DzarnoskiSusie Johansson
- A New Method for Testing Electrolytic Capacitors to Compare Life ExpectancyStephani GulbrandsenJoelle ArnoldNick KirschGreg Caswell
- Dielectric Laser Via Drilling for Next Generation Wafer Level ProcessingJim ZaccardiGuy BurgessTheodore TessierKen LafenhagenMatt Souter
- Assembly Standardization for the Diverse Packaging Requirements of MEMS & SensorsRussell Shumway
- Pulsed 2 Micron Wavelength Fiber Lasers for PackagingShibin Jiang
- Applying system modeling to define 2.5 - d and 3 - d packaging roadmapsDev Gupta
- Sapphire Surface Protection During Sapphire Micromachining and Through-Sapphire Via Formation for Device Densification, Backside Interconnect and Chip StackingSyed Sajid AhmadFred HaringGreg StrommenKevin MattsonAaron Reinholz
- Path Finding for Multiple PlatformsJohn Park
- Next Generation Electrochemical Deposition TSV FillBioh KimStephen GolovatoTyler BarberaKeiichi FujitaTakashi Tanaka
- Fatigue testing of bulk materials using a microsystems based approachLi-Anne LiewDavid T. ReadNicholas Barbosa
- 3D Technology Applications Market Trends & Key ChallengesThibault BuissonAmandine PizzagalliEric MounierRozalia Beica
- Efficient TSV Resist and Residue Removal in 3DICKimberly PollardMeng GuoRichie PetersMike PhenisLaura MauerJohn TaddeiRamey YoussefJohn Clark
- 2D PCB WITH 3D PRINT FABRICATIONS FOR RIGID-CONFORMAL PACKAGING OF MICROSENSOR IMAGING ARRAYS BASED ON BIOINSPIRED ARCHITECTURESDavid FriesChase StarrGeran Barton
- Trends in Automotive PackagingGlenn G. Daves
- Wafer level packaging for high-brightness LED lighting with optimized thermal dissipation and optical performanceLiang WangGabe GuevaraRey CoRon ZhangRoseann Alatorre
- Heterogeneous Integration of Photonic Integrated Circuits Using 3D Assembly Techniques: Silicon Technology and PackagingYann LamyHaykel Ben JamaaHughes MetrasStéphane BernabéSylvie MenezoLaurent Fulbert
- Integrated Localized Cooling using Piezoelectrically-Driven Synthetic JetsMichael KranzTracy HudsonMichael WhitleyBrian English
- Enabling Resist Processing Technologies for Advanced PackagingAntun PeicThorsten MatthiasJohanna BartlPaul Lindner
- Next Generation High Power Electronic Modules Based on Embedded Power SemiconductorsLars BöttcherS. KaraszkiewiczD. ManessisEckart HoeneA. Ostmann
- A Zinc Oxide nanowire-based Sensing Platform for Carbon Dioxide DetectionBruce KimAnurag Gupta
- All-silicon multi-chip modules based on ultra-thin active pixel radiation sensorsLadislav Andricek
- A Flexible Manufacturing Method for Wafer Level PackagesTom StrothmannDamien PricoloSeung Wook YoonYaojian Lin
- Progress in Fabrication and Test of Glass Interposer SubstratesAric ShoreyScott Pollard
- Control of Bump Morphology in Lead Free Solder Plating for Higher Density PackagingKoji TatsumiKyouhei MineoTakeshi HattaTakuma KataseMasayuki IshikawaAkihiro Masuda
- New Lithography Requirements driven by 2.5D Interposer ManufacturingKlaus RuhmerJoe BattagliaPhilippe Cochet
- Solderability Challenges in Emerging BGA PackagesMaria DurhamYan LiuAndy Mackie
- How to bring 3D IC to Maturity: Example of a pacemakerRenzo DAL MOLIN
- Damage Induced in Interconnect Structures Mimicking Stresses During Flip Chip PackagingIbon Ocana
- Wet Chemical Processing with Megasonics Assist for the Removal of Bumping Process PhotomasksSohn Hong SeongJohn Tracy
- Magnetic Field Imaging for 3D applicationsJan GaudestadAntonio Orozco
- Design Considerations and Ring-down Characteristics of Micromachined, High Current Density CapacitorsAubrey N. BealJohn TatarchukColin StevensThomas BaginskiMichael HamiltonRobert N. Dean
- Direct EP/EPAG - Ultrathin Surface Finish for Soldering and Wire BondingMustafa OezkoekGustavo RamosArndKilianJens Wegricht
- CupraEtch DE - Recyclable Anisotropic Etch: Differential Etch for SAP ManufacturingStephan HotzRami HaidarSven LamprechtNorbert Luetzow
- Through-Sapphire Via Filling Process Development for Backside Interconnect and Chip Stacking and Front-to-Back Daisy Chain ChipSyed Sajid AhmadFred HaringAaron ReinholzNathan Schneck
- ADVANCED ORGANIC SUBSTRATE TECHNOLOGIES FOR HIGH PERFORMANCE, HIGH RELIABILITY ELECTRONICS MINIATURIZATIONSusan BagenDave AlcoeKim BlackwellFrank Egitto
- A cost effective PoP structure with high I/O densityHongjie WangWeidong HuangFei GengYuan LuBo ZhangWen YinHaidong Wang
- Evaluation of Polymer Core Solderballs for Wafer Level Reliability ImprovementsJohn HuntAdren HsiehEddie TsaiChienfan ChenTsaiying Wang
- Precise solder dispensing in high-throughput micro-device packaging applicationsHanzhuang LiangLinh RollandFloriana SuriawidjajaMani AhmadiHeakyoung Park
- A MEMS DC Current Sensor Utilizing Neodymium Rare Earth MagnetsJohn J. TatarchukColin B. StevensRobert N. Dean
- Optimized TSV Module for High Performance 2.5D Device PackagingCyprian UzohLiang WangZhuowen SunAndrew CaoBong-Sub LeeGuilian GaoHong ShenSitaram Arkalgud
- Versatile Lead-Free Solder Electroplating Products for Advanced Bumping TechnologiesInho LeeRegina ChoLou GrippoYen-Lin TaylorWayne BaldelliRyan FarrellJulia WoertinkYi QinJonathan PrangeYil-Hak LeeMasaaki ImanariJianwei DongJeff Calvert
- Development of Passives on Sapphire BacksideSyed Sajid AhmadCherish Bauer-ReichFred HaringGreg StrommenKevin MattsonAaron Reinholz
- Die Stacking is Happening in Mainstream ComputinBryan Black
- UV-C LEDs for Sterilization ApplicationsJoe Grzyb
Park, John. 2014. “Path Finding for Multiple Platforms.” IMAPSource Proceedings 2014 (DPC): 2036–56. https://doi.org/10.4071/2014DPC-tha24.