ISSN 2380-4505
Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
Direct EP/EPAG - Ultrathin Surface Finish for Soldering and Wire Bonding
Direct EP/EPAG - Ultrathin Surface Finish for Soldering and Wire Bonding
Mustafa Oezkoek, Gustavo RamosArnd, KilianJens Wegricht,
Oezkoek, Mustafa, Gustavo RamosArnd, and KilianJens Wegricht. 2014. “Direct EP/EPAG - Ultrathin Surface Finish for Soldering and Wire Bonding.” IMAPSource Proceedings 2014 (DPC): 1328–60. https://doi.org/10.4071/2014DPC-wa23.