ISSN 2380-4505
Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
Adhesive Enabling Technology for Direct Metal Deposition on Molding Resin
Adhesive Enabling Technology for Direct Metal Deposition on Molding Resin
Kenichiroh Mukai, Kwonil Kim, Brian Eastep, Lee Gaherty, Anirudh Kashyap, Lutz Brandt,
Articles in Vol. 2014, Issue DPC, 2014
Vol. 2014, Issue DPC, 2014
- A Current-Controlled PCB Integrated MEMS Tilt MirrorRobert N. DeanColin B. StevensJohn J. Tatarchuk
- Cost Comparison of Temporary Bond and Debond Methods For Thin Wafer HandlingAmy PaleskoChet Palesko
- Manufacturing Readiness of BVA(TM) Technology for Fine-Pitch Package-on-PackageWael ZohniRajesh KatkarRey CoRizza Cizek
- Packaging Materials for Flip Chip and WLP: Underfill Design Using FEM for FC-BGA, FC-CSP, and Moving Towards 2.5/3D.Brian SchmaltzYukinari AbeKazuyuki Kohara
- Reverse Engineering for the Purpose of Intellectual Property Protection and Accelerated Product Development in SOC and SIP StructuresLajos (Louis) BurgyanYuji Kakizaki
- MEMS- Based Cryogenic Coolers - Micro Joule - Thomson Cryogenic CoolersYunda WangYC Lee
- A PCB Technology Moisture Content and Electrical Conductivity Sensor Probe for Agricultural and Horticultural ApplicationsRobert N. DeanElizabeth GuertalAdam NewbyGlenn Fain
- Thermal Aging of Optically SiliconesMichelle VelderrainMichelle Poliskie
- Non-Conductive Film (NCF) with No Voiding and High ReliabilityEdgardo AnzuresAnupam ChoubeyAvin DhobleDavid FlemingRobert BarrJeffrey CalvertJoon-Seok Oh
- 2.5D and 3D Integration Technology UpdateRobert Patti
- Mobile Packaging and Interconnect TrendsBrandon Prior
- High Throughput Thin Wafer Support Technology for 3DICJohn MooreJared PettitDavid YoungAlman Law
- Challenges and Directions in Mobile Device PackagingSteve Bezuk
- ARM Dual Core Product Demonstration with 2.5D Through-Silicon-Via (TSV)Michael KellyRick Reed
- Electrical Performance Comparison between fcBGA and eWLB PackagesKai LiuYongTaek LeeHyunTai KimMaPhooPwint HlaingGwang. KimSusan ParkBilly Ahn
- Metrology and Inspection for New Interconnects in Advanced PackagingRuss DudleyMatt WilsonRajiv Roy
- A Decade of High Accuracy Die Attach Equipment and Process Developments (Addressing Photonics Device Packaging Challenges)Johann WeinhaendlerRudolf KaiserHardy Kellermann
- Temporary Bonding Cost Of Ownership: The link between low total thickness variation and chip yieldThomas UhrmannJürgen BurggrafHarald WiesbauerJulian BravinThorsten MatthiasMarkus WimplingerPaul LindnerHerman MeynenYann CivaleRanjith JohnSheng WangPeng-Fei FuCraig YeakleGary Aw
- Use of Darkfield Laser Technology in Monitoring Particles Generated by Process Tools in Cu Pillar Bumping & Wafer Edge InspectionReza Asgari
- Optimization of Lead Free Plating for Flip Chip ApplicationsCharles L. ArvinJurg StahlWolfgang SauterHarry coxEric PerfectoValerie ObersonNathalie Normand
- Pathfinding and Design Optimization of 2.5D/3D devices in the context of multiple PCBsFarhang YazdaniJohn Park
- Adhesive Enabling Technology for Direct Metal Deposition on Molding ResinKenichiroh MukaiKwonil KimBrian EastepLee GahertyAnirudh KashyapLutz Brandt
- Patterned Permanent Bonding of Benzocyclobutene Based Dielectric Materials for Advanced Wafer Level PackagingJong-Uk KimAnupam ChoubeyRosemary BellHua DongMichael GallagherJoe LachowskiMasaki KondoCorey O'ConnorGreg ProkopowiczBob BarrDow Electronic MaterialsKai ZoschkeMatthias WegnerChristina LopperMichael ToepperFraunhofer IZM
- Present and Future Applications of MEMS for Automotive IndustryThibault Buisson
- TSV technology embedding high density capacitors for Advanced 3D packaging solutionsCatherine BunelFlorent Lallemand
- A New Type of TSV Defect Caused by BMD in Silicon SubstrateDingyou ZhangSarasvathi ThangarajuDaniel SmithHimani KamineniChristian KlewerMark ScholefieldMing LeiTong Qing ChenKumarapuram GopalakrishnanAbhishek VikramVictor LimWonwoo KimRamakanth Alapati
- Adhesive Enabling Technology for Directly Plating Copper onto GlassLutz BrandtZhiming LiuHailuo FuSara HunegnawTafadzwa Magaya
- Embedding Active and Passive Devices in Medical ElectronicsJohn DzarnoskiSusie Johansson
- A New Method for Testing Electrolytic Capacitors to Compare Life ExpectancyStephani GulbrandsenJoelle ArnoldNick KirschGreg Caswell
- Dielectric Laser Via Drilling for Next Generation Wafer Level ProcessingJim ZaccardiGuy BurgessTheodore TessierKen LafenhagenMatt Souter
- Assembly Standardization for the Diverse Packaging Requirements of MEMS & SensorsRussell Shumway
- Pulsed 2 Micron Wavelength Fiber Lasers for PackagingShibin Jiang
- Applying system modeling to define 2.5 - d and 3 - d packaging roadmapsDev Gupta
- Sapphire Surface Protection During Sapphire Micromachining and Through-Sapphire Via Formation for Device Densification, Backside Interconnect and Chip StackingSyed Sajid AhmadFred HaringGreg StrommenKevin MattsonAaron Reinholz
- Path Finding for Multiple PlatformsJohn Park
- Next Generation Electrochemical Deposition TSV FillBioh KimStephen GolovatoTyler BarberaKeiichi FujitaTakashi Tanaka
- Fatigue testing of bulk materials using a microsystems based approachLi-Anne LiewDavid T. ReadNicholas Barbosa
- 3D Technology Applications Market Trends & Key ChallengesThibault BuissonAmandine PizzagalliEric MounierRozalia Beica
- Efficient TSV Resist and Residue Removal in 3DICKimberly PollardMeng GuoRichie PetersMike PhenisLaura MauerJohn TaddeiRamey YoussefJohn Clark
- 2D PCB WITH 3D PRINT FABRICATIONS FOR RIGID-CONFORMAL PACKAGING OF MICROSENSOR IMAGING ARRAYS BASED ON BIOINSPIRED ARCHITECTURESDavid FriesChase StarrGeran Barton
- Trends in Automotive PackagingGlenn G. Daves
- Wafer level packaging for high-brightness LED lighting with optimized thermal dissipation and optical performanceLiang WangGabe GuevaraRey CoRon ZhangRoseann Alatorre
- Heterogeneous Integration of Photonic Integrated Circuits Using 3D Assembly Techniques: Silicon Technology and PackagingYann LamyHaykel Ben JamaaHughes MetrasStéphane BernabéSylvie MenezoLaurent Fulbert
- Integrated Localized Cooling using Piezoelectrically-Driven Synthetic JetsMichael KranzTracy HudsonMichael WhitleyBrian English
- Enabling Resist Processing Technologies for Advanced PackagingAntun PeicThorsten MatthiasJohanna BartlPaul Lindner
- Next Generation High Power Electronic Modules Based on Embedded Power SemiconductorsLars BöttcherS. KaraszkiewiczD. ManessisEckart HoeneA. Ostmann
- A Zinc Oxide nanowire-based Sensing Platform for Carbon Dioxide DetectionBruce KimAnurag Gupta
- All-silicon multi-chip modules based on ultra-thin active pixel radiation sensorsLadislav Andricek
- A Flexible Manufacturing Method for Wafer Level PackagesTom StrothmannDamien PricoloSeung Wook YoonYaojian Lin
- Progress in Fabrication and Test of Glass Interposer SubstratesAric ShoreyScott Pollard
- Control of Bump Morphology in Lead Free Solder Plating for Higher Density PackagingKoji TatsumiKyouhei MineoTakeshi HattaTakuma KataseMasayuki IshikawaAkihiro Masuda
- New Lithography Requirements driven by 2.5D Interposer ManufacturingKlaus RuhmerJoe BattagliaPhilippe Cochet
- Solderability Challenges in Emerging BGA PackagesMaria DurhamYan LiuAndy Mackie
- How to bring 3D IC to Maturity: Example of a pacemakerRenzo DAL MOLIN
- Damage Induced in Interconnect Structures Mimicking Stresses During Flip Chip PackagingIbon Ocana
- Wet Chemical Processing with Megasonics Assist for the Removal of Bumping Process PhotomasksSohn Hong SeongJohn Tracy
- Magnetic Field Imaging for 3D applicationsJan GaudestadAntonio Orozco
- Design Considerations and Ring-down Characteristics of Micromachined, High Current Density CapacitorsAubrey N. BealJohn TatarchukColin StevensThomas BaginskiMichael HamiltonRobert N. Dean
- Direct EP/EPAG - Ultrathin Surface Finish for Soldering and Wire BondingMustafa OezkoekGustavo RamosArndKilianJens Wegricht
- CupraEtch DE - Recyclable Anisotropic Etch: Differential Etch for SAP ManufacturingStephan HotzRami HaidarSven LamprechtNorbert Luetzow
- Through-Sapphire Via Filling Process Development for Backside Interconnect and Chip Stacking and Front-to-Back Daisy Chain ChipSyed Sajid AhmadFred HaringAaron ReinholzNathan Schneck
- ADVANCED ORGANIC SUBSTRATE TECHNOLOGIES FOR HIGH PERFORMANCE, HIGH RELIABILITY ELECTRONICS MINIATURIZATIONSusan BagenDave AlcoeKim BlackwellFrank Egitto
- A cost effective PoP structure with high I/O densityHongjie WangWeidong HuangFei GengYuan LuBo ZhangWen YinHaidong Wang
- Evaluation of Polymer Core Solderballs for Wafer Level Reliability ImprovementsJohn HuntAdren HsiehEddie TsaiChienfan ChenTsaiying Wang
- Precise solder dispensing in high-throughput micro-device packaging applicationsHanzhuang LiangLinh RollandFloriana SuriawidjajaMani AhmadiHeakyoung Park
- A MEMS DC Current Sensor Utilizing Neodymium Rare Earth MagnetsJohn J. TatarchukColin B. StevensRobert N. Dean
- Optimized TSV Module for High Performance 2.5D Device PackagingCyprian UzohLiang WangZhuowen SunAndrew CaoBong-Sub LeeGuilian GaoHong ShenSitaram Arkalgud
- Versatile Lead-Free Solder Electroplating Products for Advanced Bumping TechnologiesInho LeeRegina ChoLou GrippoYen-Lin TaylorWayne BaldelliRyan FarrellJulia WoertinkYi QinJonathan PrangeYil-Hak LeeMasaaki ImanariJianwei DongJeff Calvert
- Development of Passives on Sapphire BacksideSyed Sajid AhmadCherish Bauer-ReichFred HaringGreg StrommenKevin MattsonAaron Reinholz
- Die Stacking is Happening in Mainstream ComputinBryan Black
- UV-C LEDs for Sterilization ApplicationsJoe Grzyb
Mukai, Kenichiroh, Kwonil Kim, Brian Eastep, Lee Gaherty, Anirudh Kashyap, and Lutz Brandt. 2014. “Adhesive Enabling Technology for Direct Metal Deposition on Molding Resin.” IMAPSource Proceedings 2014 (DPC): 1670–93. https://doi.org/10.4071/2014DPC-wp25.