Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
3D Transmission Line Design for High Power RF Components in Laminates
3D Transmission Line Design for High Power RF Components in Laminates
Sungjun Kim, Arthur Yang Zhang, Mark Bachman, G. P. Li,
Kim, Sungjun, Arthur Yang Zhang, Mark Bachman, and G. P. Li. 2011. “3D Transmission Line Design for High Power RF Components in Laminates.” IMAPSource Proceedings 2011 (DPC): 580–96. https://doi.org/10.4071/2011DPC-ta23.