ISSN 2380-4505
Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
Realization of Power Modules by Chip Embedding Technology
Realization of Power Modules by Chip Embedding Technology
Lars Boettcher, D. Manessis, S. Karaszkiewicz, A. Ostmann,
Boettcher, Lars, D. Manessis, S. Karaszkiewicz, and A. Ostmann. 2011. “Realization of Power Modules by Chip Embedding Technology.” IMAPSource Proceedings 2011 (DPC): 1019–45. https://doi.org/10.4071/2011DPC-tp32.