ISSN 2380-4505
Articles in Vol. 2011, Issue DPC, 2011
Vol. 2011, Issue DPC, 2011
- Packaging of MEMS for Integrated RF Circuit VerificationsBruce C. KimSai EvanaRahim Kasim
- Diatom-based Sensors: Organic/Inorganic Interfaces and Health Science ApplicationMichael GoryllXiaofeng WangShankar RamakrishnanKai-Chun LinKaushal RegeSandwip DeyB. L. Ramakrishna
- Coaxial Through-Strata-Via (TSV) Analysis and ModelingZheng XuJames Jian-Qiang Lu
- PCBMEMS as a Flexible Path to Devices and Systems across Spatial ScalesDavid FriesLiesl HotalingGeran BartonStan IvanovMichelle JanowiakMatt Smith
- Laser Technology for Through-Silicon Via and Microvia Drilling in Silicon for 3D Packaging ApplicationsAndy HooperDaragh FinnShane NoelGregg AndersonJim O'BrienChi-Cheng Lin
- Impact of Process Improvements on Reliability of RCP Technology During Scale-upGeorge R. LealScott HayesDominic KoeyTony GongDoug MitchellGao WeiJason WrightTony Vessa
- Low Cost, High Reliability WLCSP for Higher Pin CountsTony CurtisSenthil SivaswamyRonnie YazzieDavid LawheadTheodore G. Tessier
- Status of the EMC3D Consortia to Cost ObjectivesPaul Siblerud
- 3D TSV ProductsPhil Marcoux
- Electromigration in Solder Joints for High Temperature Flip-Chip ApplicationMathias NowottnickAndreas Fix
- Flip Chip Fine Pitch PBGA Yield StudyTim PhamBetty YeungTrent UehlingBrett Wilkerson
- Wafer Level Package for MEMS with TSVs and Hermetic SealAkinori ShiraishiMitsutoshi HigashiKei MurayamaYuichi TaguchiKenichi Mori
- Packaging Related Failure Modes of Microelectronic ComponentsMichael Hertl
- Silicon Interposers Enable High Performance CapacitorsSergey SavastioukPhil MarcouxJim Hewlett
- Hetero-Structure Integration using an Atmospheric Plasma Treatment for Surface Preparation before its InterconnectionBarbara CharletB. CharletL. Di CioccioN. RochatO. RenaultL. ClavelierC. Deguet
- Novel Die-to-Wafer Interconnect Process for 3D-IC Utilizing a Thermo-Decomposable Adhesive and Cu-Cu Thermo-Compression BondingDaniel N. Pascual
- Towards a Parametrically Pumped Xylophone Bar MagnetometerHarry T.D. Grigg
- Electrolytic Solder Deposition for IC-Substrates: From Deposition Uniformity to Solder Ball GeometryBernd RoelfsKai Matejat
- A Novel Approach to 3D Chip StackingMark VandermeulenAndrew SmithRon Csermak
- 3D-TSV Test Options and Process CompatibilityKen SmithPeter HanawayMike JolleyReed GleasonEric Strid
- RF System-in-Packages: History and TrendKai LiuBilly AhnTom StrothmannYeong LeeFlynn Carson
- A New Robust One-Shot Switch for High-Power Pulse ApplicationsThomas A. BaginskiRobert N. DeanSteven P. Surgnier
- Realization of Power Modules by Chip Embedding TechnologyLars BoettcherD. ManessisS. KaraszkiewiczA. Ostmann
- 300mm Scaling of Critical Silicon Etches for Image Sensor Wafer-Level Packaging Based on Tessera's MVP (TSV) TechnologyDave ThomasMatthew MuggeridgeMike SteelDorleta Cortaberria SanzHefin GriffithsOliver AnsellMoshe KrimanAndrey GrinmanHagit Gershtenman-Avsian
- Copper Migration in Flip-Chip Substrates Under Biased-HAST ConditionsMatthew E. StahleyJohn W. Osenbach
- Formulation of Percolating Thermal Underfill by Sequential Convective Gap FillingT. BrunschwilerJ. GoicocheaH. WolfC. KueminB. Michel
- A Novel Frequency Addressable Micro Switch ArrayMinfeng WangYang ZhangG. P. LiMark Bachman
- Cu MEMSCharles EllisAubrey BealRobert Dean
- Failure Analysis and Reliability of 3D Integrated SystemsPeter RammArmin KlumppGerman FranzLaurens Kwakman
- Cu Pillar is Ready for Prime TimeBernd K AppeltHarrison ChungRaymond Wang
- Laser Processing of 2-D and 3-D Structures for Tunable Embedded CapacitorsRabindra N. DasTimothy E. AntesbergerFrancesco MarconiFrank D. EgittoMark D. PoliksVoya R. Markovich
- Cost Effective Production of Glass Interposers for 3D ICs Using APEX(TM) Glass CeramicJeb H. FlemmingKevin DunnJames GoukerCarrie Schmidt
- Flexible Metamaterials RF Filters Implemented through Micromachining LCP SubstratesJonathan RichardRobert Dean
- Processing and Reliability Assessment of Silicon Based, Integrated Ultra High Density SubstratesBrian J. LewisD. F. BaldwinP. N. HoustonB. SmithP. KwokJ. Thompson. A. MuellerL. Racz
- Cu-Cu Thermocompression Bonding using Ultra Precision Cutting of Cu Bumps for 3D-SICTaiji SakaiAkamatsu ToshiyaNobuhiro ImaizumiMiyajima ToyooMasataka Mizukoshi
- Manufacturing Substrates with Embedded PassivesRabindra N. DasKonstantinos I. PapathomasJohn M. LaufferMark D. PoliksVoya R. Markovich
- Advanced 3DIC Die Stacking for Memory and Mobile ApplicationsDave Hiner
- Temperature and Humidity Effects on MEMS Vibratory GyroscopeChandradip PatelF. Patrick McCluskeyDavid Lemus
- Cost Comparison of Fan-Out WLP vs. Embedded DieAlan PaleskoJan Vardaman
- Packaging HB LEDs with Integrated BeamshapingThomas Hoeftmann
- Evaluation of Low Stress Photo-Sensitive Spin On Dielectric Layers for Through Silicon Via (TSV) Copper Redistribution LayersChristopher JahnesEric HuengerScott Kisting
- Electromigration Reliability of Cu Pillar on Substrate Interconnects in High Performance Flip Chip PackagesRajesh KatkarMichael HuynhLaura Mirkarimi
- Packaging of High Brightness, Big-Chip LEDsLidia LeePaul Panaccione
- Can High Density 3D Through Silicon Stacking Replace Lithography-Driven CMOS Scaling as the Engine for the Semiconductor Industry?Matt NowakBrian Henderson
- Aerosol Jet Printer as an Alternative to Wire Bond and TSV Technology for 3D Interconnect ApplicationsMichael O'ReillyMichael J. RennStephen Barnes
- Novel Wet Chemical Copper Metallization for Glass InterposersSimon BambergRalf BrueningJohannes EtzkornFrank Bruening
- Evalulation of Electrodeposited Photoresists for use in the Fabrication of an Optochip Silicon InterposerCornelia TsangJanet OkadaEric Huenger
- Permanent Attachment of Silicon Structures via Joule Heat Induced WeldingAdam R. SchofieldAlexander A. TrusovAndrei M. Shkel
- 3D-IC Integration Using D2C or D2W Alignment Schemes Together with Local Oxide ReductionGilbert LecarpentierJean-Stephane MottetKeith CooperMichael Stead
- Z-Axis Interconnection in Organic PackagingFrank EgittoT. AntesbergerR. DasV. MarkovichS. RosserM. SchadtW. Wilson
- High Throuput Fluidic PCBs for Medical DevicesStefan GassmannLienhard Pagel
- CMOS Analog Front-End IC for Gas SensorsHyuntae KimBertan Bakkaloglu
- High-speed SnAG Solder Electroplating Process and Developments on Cost ReductionBob Forman
- SUEX Laminates for Fan-In, Fan-Out and eWLB DevelopmentDonald W. JohnsonBin-Hong Tsai
- RF System in Packages (SiP) using Integrated Passive DevicesKai LiuYongTaek LeeHyunTai KimGwang KimBilly Ahn
- SiP(System in Package) Solutions with Wafer Level Packaging TechnologyIn Soo KangJong Heon (Jay) Kim
- Packaging Strategies for Mitigation of Mechanical Noise in Sensor SystemsPhilip ReinerCalvin W. Long
- Flip Chip and Wafer Level Packaging - Past, Present and FuturePeter Elenius
- Effects of Under-Fill Curing on Substrate WarpageRobert L. Hubbard
- Fundamentals of a MEMS Rate Integrating Gyroscope that Exploits Wave InertiaBarry J. Gallacher
- Cu Pillar Bumping Technology with Solder Alloy VersatilityGuy BurgessAnthony CurtisTom NilssonGene StoutTheodore G. Tessier
- Low Profile Silicon Interposer using Passive Integration (PICS)Catherine BunelStephane BellengerSebastien LeruezLionel LenoirFranck Murray
- TSV Resist and Residue RemovalLaura MauerJohn TaddeiRamey YoussefKimberly PollardAllison Rector
- 3D Packages with TSV Silicon InterposersMike Kelly
- Advanced Laser Scribing for Emerging LED MaterialsMarco MendesJeffrey SercelMathew HannonCristian PornealaXiangyang SongJie FuRouzbeh Sarrafi
- Stacking of Known Good Rebuilt Wafers without TSV - Industrial ApplicationsChristian ValPascal CoudercNadia Boulay
- Commercial-off-the-Shelf (COTS) 3D Integration using Low Temperature Wafer BondingSang Hwui LeeMichael Khbeis
- 3DIC & TSV Interconnects: Applications, Market & Infrastructure ReadinessJerome Baron
- Solutions for Wafer-Level Packaging of High Brightness LEDsThomas UhrmannB. KimT. MatthiasP. Lindner
- Flip Chip for Image Sensor PackagingDeok-Hoon KimYoung-Sang ChoPeter Elenius
- Through Package Defect Localization by Lock-In ThermographyRudolf SchlangenHerve DeslandesToru TodaToshinobu NagatomoShigeki SakoHiromichi Sawaya
- In-Situ Wafer-Level Polarization of Electret Films in MEMS Acoustic Sensor ArraysMichael KranzMark AllenTracy Hudson
- Flip-Chip Technologies, Applications, Market Status and ForecastsChristophe ZinckJean-Marc YannouJérôme BaronPhil Garou
- Thermal Analysis for a Novel 3D Heterogenous Integrated Platform MorPackShih-Lun ChenChun-Ming HuangChien-Ming WuChih-Chyau YangJin-Ju ChueShih-Lun ChenChi-Shi ChenJiann-Jenn WangTzi-Dar Chiueh
- 300mm Large Scale eWLB(embedded Wafer Level BGA) : Cost Effective Solution with PerformanceSeung Wook YoonYaojian LinPandi C. MarimuthuYeong J. Lee
- Miniature MEMS Interface Circuits Using Nanoparticle Conductors and Embedded ComponentsC. Paul Christensen
- Ultrathin WLP Die Embedded Polyimide Multi-Layer Wiring BoardSatoshi OkudeM. OkamotoY. SanoN. UetaO. Nakao
- Lessons Learned from 3D-IC MPW RunsRobert Patti
- 300mm Wafer-Level Image Sensor PackagingThorsten MatthiasBioh KimGerald MittendorferPaul LindnerMoshe KrimanAndrey GrinmanAlex Feldman
- 3D Transmission Line Design for High Power RF Components in LaminatesSungjun KimArthur Yang ZhangMark BachmanG. P. Li
Marcoux, Phil. 2011. “3D TSV Products.” IMAPSource Proceedings 2011 (DPC): 434–57. https://doi.org/10.4071/2011DPC-ta11.