ISSN 2380-4505
Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
Advanced Laser Scribing for Emerging LED Materials
Advanced Laser Scribing for Emerging LED Materials
Marco Mendes, Jeffrey Sercel, Mathew Hannon, Cristian Porneala, Xiangyang Song, Jie Fu, Rouzbeh Sarrafi,
Articles in Vol. 2011, Issue DPC, 2011
Vol. 2011, Issue DPC, 2011
- Packaging of MEMS for Integrated RF Circuit VerificationsBruce C. KimSai EvanaRahim Kasim
- Diatom-based Sensors: Organic/Inorganic Interfaces and Health Science ApplicationMichael GoryllXiaofeng WangShankar RamakrishnanKai-Chun LinKaushal RegeSandwip DeyB. L. Ramakrishna
- Coaxial Through-Strata-Via (TSV) Analysis and ModelingZheng XuJames Jian-Qiang Lu
- PCBMEMS as a Flexible Path to Devices and Systems across Spatial ScalesDavid FriesLiesl HotalingGeran BartonStan IvanovMichelle JanowiakMatt Smith
- Laser Technology for Through-Silicon Via and Microvia Drilling in Silicon for 3D Packaging ApplicationsAndy HooperDaragh FinnShane NoelGregg AndersonJim O'BrienChi-Cheng Lin
- Impact of Process Improvements on Reliability of RCP Technology During Scale-upGeorge R. LealScott HayesDominic KoeyTony GongDoug MitchellGao WeiJason WrightTony Vessa
- Low Cost, High Reliability WLCSP for Higher Pin CountsTony CurtisSenthil SivaswamyRonnie YazzieDavid LawheadTheodore G. Tessier
- Status of the EMC3D Consortia to Cost ObjectivesPaul Siblerud
- 3D TSV ProductsPhil Marcoux
- Electromigration in Solder Joints for High Temperature Flip-Chip ApplicationMathias NowottnickAndreas Fix
- Flip Chip Fine Pitch PBGA Yield StudyTim PhamBetty YeungTrent UehlingBrett Wilkerson
- Wafer Level Package for MEMS with TSVs and Hermetic SealAkinori ShiraishiMitsutoshi HigashiKei MurayamaYuichi TaguchiKenichi Mori
- Packaging Related Failure Modes of Microelectronic ComponentsMichael Hertl
- Silicon Interposers Enable High Performance CapacitorsSergey SavastioukPhil MarcouxJim Hewlett
- Hetero-Structure Integration using an Atmospheric Plasma Treatment for Surface Preparation before its InterconnectionBarbara CharletB. CharletL. Di CioccioN. RochatO. RenaultL. ClavelierC. Deguet
- Novel Die-to-Wafer Interconnect Process for 3D-IC Utilizing a Thermo-Decomposable Adhesive and Cu-Cu Thermo-Compression BondingDaniel N. Pascual
- Towards a Parametrically Pumped Xylophone Bar MagnetometerHarry T.D. Grigg
- Electrolytic Solder Deposition for IC-Substrates: From Deposition Uniformity to Solder Ball GeometryBernd RoelfsKai Matejat
- A Novel Approach to 3D Chip StackingMark VandermeulenAndrew SmithRon Csermak
- 3D-TSV Test Options and Process CompatibilityKen SmithPeter HanawayMike JolleyReed GleasonEric Strid
- RF System-in-Packages: History and TrendKai LiuBilly AhnTom StrothmannYeong LeeFlynn Carson
- A New Robust One-Shot Switch for High-Power Pulse ApplicationsThomas A. BaginskiRobert N. DeanSteven P. Surgnier
- Realization of Power Modules by Chip Embedding TechnologyLars BoettcherD. ManessisS. KaraszkiewiczA. Ostmann
- 300mm Scaling of Critical Silicon Etches for Image Sensor Wafer-Level Packaging Based on Tessera's MVP (TSV) TechnologyDave ThomasMatthew MuggeridgeMike SteelDorleta Cortaberria SanzHefin GriffithsOliver AnsellMoshe KrimanAndrey GrinmanHagit Gershtenman-Avsian
- Copper Migration in Flip-Chip Substrates Under Biased-HAST ConditionsMatthew E. StahleyJohn W. Osenbach
- Formulation of Percolating Thermal Underfill by Sequential Convective Gap FillingT. BrunschwilerJ. GoicocheaH. WolfC. KueminB. Michel
- A Novel Frequency Addressable Micro Switch ArrayMinfeng WangYang ZhangG. P. LiMark Bachman
- Cu MEMSCharles EllisAubrey BealRobert Dean
- Failure Analysis and Reliability of 3D Integrated SystemsPeter RammArmin KlumppGerman FranzLaurens Kwakman
- Cu Pillar is Ready for Prime TimeBernd K AppeltHarrison ChungRaymond Wang
- Laser Processing of 2-D and 3-D Structures for Tunable Embedded CapacitorsRabindra N. DasTimothy E. AntesbergerFrancesco MarconiFrank D. EgittoMark D. PoliksVoya R. Markovich
- Cost Effective Production of Glass Interposers for 3D ICs Using APEX(TM) Glass CeramicJeb H. FlemmingKevin DunnJames GoukerCarrie Schmidt
- Flexible Metamaterials RF Filters Implemented through Micromachining LCP SubstratesJonathan RichardRobert Dean
- Processing and Reliability Assessment of Silicon Based, Integrated Ultra High Density SubstratesBrian J. LewisD. F. BaldwinP. N. HoustonB. SmithP. KwokJ. Thompson. A. MuellerL. Racz
- Cu-Cu Thermocompression Bonding using Ultra Precision Cutting of Cu Bumps for 3D-SICTaiji SakaiAkamatsu ToshiyaNobuhiro ImaizumiMiyajima ToyooMasataka Mizukoshi
- Manufacturing Substrates with Embedded PassivesRabindra N. DasKonstantinos I. PapathomasJohn M. LaufferMark D. PoliksVoya R. Markovich
- Advanced 3DIC Die Stacking for Memory and Mobile ApplicationsDave Hiner
- Temperature and Humidity Effects on MEMS Vibratory GyroscopeChandradip PatelF. Patrick McCluskeyDavid Lemus
- Cost Comparison of Fan-Out WLP vs. Embedded DieAlan PaleskoJan Vardaman
- Packaging HB LEDs with Integrated BeamshapingThomas Hoeftmann
- Evaluation of Low Stress Photo-Sensitive Spin On Dielectric Layers for Through Silicon Via (TSV) Copper Redistribution LayersChristopher JahnesEric HuengerScott Kisting
- Electromigration Reliability of Cu Pillar on Substrate Interconnects in High Performance Flip Chip PackagesRajesh KatkarMichael HuynhLaura Mirkarimi
- Packaging of High Brightness, Big-Chip LEDsLidia LeePaul Panaccione
- Can High Density 3D Through Silicon Stacking Replace Lithography-Driven CMOS Scaling as the Engine for the Semiconductor Industry?Matt NowakBrian Henderson
- Aerosol Jet Printer as an Alternative to Wire Bond and TSV Technology for 3D Interconnect ApplicationsMichael O'ReillyMichael J. RennStephen Barnes
- Novel Wet Chemical Copper Metallization for Glass InterposersSimon BambergRalf BrueningJohannes EtzkornFrank Bruening
- Evalulation of Electrodeposited Photoresists for use in the Fabrication of an Optochip Silicon InterposerCornelia TsangJanet OkadaEric Huenger
- Permanent Attachment of Silicon Structures via Joule Heat Induced WeldingAdam R. SchofieldAlexander A. TrusovAndrei M. Shkel
- 3D-IC Integration Using D2C or D2W Alignment Schemes Together with Local Oxide ReductionGilbert LecarpentierJean-Stephane MottetKeith CooperMichael Stead
- Z-Axis Interconnection in Organic PackagingFrank EgittoT. AntesbergerR. DasV. MarkovichS. RosserM. SchadtW. Wilson
- High Throuput Fluidic PCBs for Medical DevicesStefan GassmannLienhard Pagel
- CMOS Analog Front-End IC for Gas SensorsHyuntae KimBertan Bakkaloglu
- High-speed SnAG Solder Electroplating Process and Developments on Cost ReductionBob Forman
- SUEX Laminates for Fan-In, Fan-Out and eWLB DevelopmentDonald W. JohnsonBin-Hong Tsai
- RF System in Packages (SiP) using Integrated Passive DevicesKai LiuYongTaek LeeHyunTai KimGwang KimBilly Ahn
- SiP(System in Package) Solutions with Wafer Level Packaging TechnologyIn Soo KangJong Heon (Jay) Kim
- Packaging Strategies for Mitigation of Mechanical Noise in Sensor SystemsPhilip ReinerCalvin W. Long
- Flip Chip and Wafer Level Packaging - Past, Present and FuturePeter Elenius
- Effects of Under-Fill Curing on Substrate WarpageRobert L. Hubbard
- Fundamentals of a MEMS Rate Integrating Gyroscope that Exploits Wave InertiaBarry J. Gallacher
- Cu Pillar Bumping Technology with Solder Alloy VersatilityGuy BurgessAnthony CurtisTom NilssonGene StoutTheodore G. Tessier
- Low Profile Silicon Interposer using Passive Integration (PICS)Catherine BunelStephane BellengerSebastien LeruezLionel LenoirFranck Murray
- TSV Resist and Residue RemovalLaura MauerJohn TaddeiRamey YoussefKimberly PollardAllison Rector
- 3D Packages with TSV Silicon InterposersMike Kelly
- Advanced Laser Scribing for Emerging LED MaterialsMarco MendesJeffrey SercelMathew HannonCristian PornealaXiangyang SongJie FuRouzbeh Sarrafi
- Stacking of Known Good Rebuilt Wafers without TSV - Industrial ApplicationsChristian ValPascal CoudercNadia Boulay
- Commercial-off-the-Shelf (COTS) 3D Integration using Low Temperature Wafer BondingSang Hwui LeeMichael Khbeis
- 3DIC & TSV Interconnects: Applications, Market & Infrastructure ReadinessJerome Baron
- Solutions for Wafer-Level Packaging of High Brightness LEDsThomas UhrmannB. KimT. MatthiasP. Lindner
- Flip Chip for Image Sensor PackagingDeok-Hoon KimYoung-Sang ChoPeter Elenius
- Through Package Defect Localization by Lock-In ThermographyRudolf SchlangenHerve DeslandesToru TodaToshinobu NagatomoShigeki SakoHiromichi Sawaya
- In-Situ Wafer-Level Polarization of Electret Films in MEMS Acoustic Sensor ArraysMichael KranzMark AllenTracy Hudson
- Flip-Chip Technologies, Applications, Market Status and ForecastsChristophe ZinckJean-Marc YannouJérôme BaronPhil Garou
- Thermal Analysis for a Novel 3D Heterogenous Integrated Platform MorPackShih-Lun ChenChun-Ming HuangChien-Ming WuChih-Chyau YangJin-Ju ChueShih-Lun ChenChi-Shi ChenJiann-Jenn WangTzi-Dar Chiueh
- 300mm Large Scale eWLB(embedded Wafer Level BGA) : Cost Effective Solution with PerformanceSeung Wook YoonYaojian LinPandi C. MarimuthuYeong J. Lee
- Miniature MEMS Interface Circuits Using Nanoparticle Conductors and Embedded ComponentsC. Paul Christensen
- Ultrathin WLP Die Embedded Polyimide Multi-Layer Wiring BoardSatoshi OkudeM. OkamotoY. SanoN. UetaO. Nakao
- Lessons Learned from 3D-IC MPW RunsRobert Patti
- 300mm Wafer-Level Image Sensor PackagingThorsten MatthiasBioh KimGerald MittendorferPaul LindnerMoshe KrimanAndrey GrinmanAlex Feldman
- 3D Transmission Line Design for High Power RF Components in LaminatesSungjun KimArthur Yang ZhangMark BachmanG. P. Li
Mendes, Marco, Jeffrey Sercel, Mathew Hannon, Cristian Porneala, Xiangyang Song, Jie Fu, and Rouzbeh Sarrafi. 2011. “Advanced Laser Scribing for Emerging LED Materials.” IMAPSource Proceedings 2011 (DPC): 1443–71. https://doi.org/10.4071/2011DPC-wa32.