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Device Packaging Conference Presentations
Vol. 2011, Issue DPC, 2011January 01, 2011 EDT

Evalulation of Electrodeposited Photoresists for use in the Fabrication of an Optochip Silicon Interposer

Cornelia Tsang, Janet Okada, Eric Huenger,
OptochipImage sensorsLithographyElectrodeposited photoresist3D packagingOptochipsilicon interposeroptical devicesimage sensorslithographyMEMS
https://doi.org/10.4071/2011DPC-wp13
IMAPSource Conference Papers
Tsang, Cornelia, Janet Okada, and Eric Huenger. 2011. “Evalulation of Electrodeposited Photoresists for Use in the Fabrication of an Optochip Silicon Interposer.” IMAPSource Proceedings 2011 (DPC): 1555–95. https:/​/​doi.org/​10.4071/​2011DPC-wp13.
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