Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Device Packaging Conference Presentations
Vol. 2011, Issue DPC, 2011
January 01, 2011 EDT
Flip-Chip Technologies, Applications, Market Status and Forecasts
Christophe Zinck
,
Jean-Marc Yannou
,
Jérôme Baron
,
Phil Garou
,
Flip-Chip
market
Technology overview
•
https://doi.org/10.4071/2011DPC-wp31
IMAPSource Conference Papers
Zinck, Christophe, Jean-Marc Yannou, Jérôme Baron, and Phil Garou. 2011. “Flip-Chip Technologies, Applications, Market Status and Forecasts.”
IMAPSource Proceedings
2011 (DPC): 1797–1828.
https://doi.org/10.4071/2011DPC-wp31
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats