Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
Commercial-off-the-Shelf (COTS) 3D Integration using Low Temperature Wafer Bonding
Commercial-off-the-Shelf (COTS) 3D Integration using Low Temperature Wafer Bonding
Sang Hwui Lee, Michael Khbeis,
Lee, Sang Hwui, and Michael Khbeis. 2011. “Commercial-off-the-Shelf (COTS) 3D Integration Using Low Temperature Wafer Bonding.” IMAPSource Proceedings 2011 (DPC): 836–58. https://doi.org/10.4071/2011DPC-tp16.