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Device Packaging Conference Presentations
Vol. 2011, Issue DPC, 2011
January 01, 2011 EDT
SUEX Laminates for Fan-In, Fan-Out and eWLB Development
Donald W. Johnson
,
Bin-Hong Tsai
,
Laminate Films
Fan-In/Fan-Out and eWLB
Thick Epoxy Resist Films
•
https://doi.org/10.4071/2011DPC-ta31
IMAPSource Conference Papers
Johnson, Donald W., and Bin-Hong Tsai. 2011. “SUEX Laminates for Fan-In, Fan-Out and eWLB Development.”
IMAPSource Proceedings
2011 (DPC): 635–65.
https://doi.org/10.4071/2011DPC-ta31
.
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