GaN based RF Modules - Demands & Needs for Packaging

M. Oppermann; K. Widmer; R. Reber; H. Sledzik; P. Schuh; U. Schmid; B. Bunz; S. Chartier; K. Drüeke; M. Bedenbecker

doi:10.4071/isom-2011-THA1-Paper4

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Oppermann, M., K. Widmer, R. Reber, H. Sledzik, P. Schuh, U. Schmid, B. Bunz, S. Chartier, K. Drüeke, and M. Bedenbecker. 2011. “GaN Based RF Modules - Demands & Needs for Packaging.” IMAPSource Proceedings 2011 (1): 896–99. https://doi.org/10.4071/isom-2011-THA1-Paper4.

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