Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Solder Strength Characterization Using Hot Bump Pull Testing
Solder Strength Characterization Using Hot Bump Pull Testing
O’Connell, Kevin, and Arv Sinha. 2011. “Solder Strength Characterization Using Hot Bump Pull Testing.” IMAPSource Proceedings 2011 (1): 690–93. https://doi.org/10.4071/isom-2011-WP2-Paper1.