Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Quality and Reliability of 3D TSV Interposer and Fine Pitch Solder Micro-bumps for 28nm Technology
Quality and Reliability of 3D TSV Interposer and Fine Pitch Solder Micro-bumps for 28nm Technology
Banijamali, Bahareh, Raghunandan Chaware, Suresh Ramalingam, and Myongseob Kim. 2011. “Quality and Reliability of 3D TSV Interposer and Fine Pitch Solder Micro-Bumps for 28nm Technology.” IMAPSource Proceedings 2011 (1): 189–92. https://doi.org/10.4071/isom-2011-TP1-Paper1.