ISSN 2380-4505
Articles in Vol. 2011, Issue 1, 2011
Vol. 2011, Issue 1, 2011
- SerDes Design and Modeling over 25+ Gb/s Serial LinkPervez M. AzizAdam HealeyCathy LiuFreeman ZhongAlex Zabroda
- 4-PAM System Simulation for 25 Gbps DesignsSanjeev GuptaDingqing LuKonstantinos Kladopoulos
- Comparison of Gold and Copper Wire Bonding on Aluminum and Nickel-Palladium-Gold Bond Pads for Automotive ApplicationTu Anh TranVarughese MathewHarold Downey
- Design and Process Implementation for Embedding ComponentsVern Solberg
- High temperature Au-based solder reliability in electronic packages for harsh environmentsM.F. SousaS. RichesC. JohnstonP.S. Grant
- “IC Packaging Trends Causing Concerns in Complete Flux Removal”Rich Brooks
- Suppression of Kirkendall voiding in Sn-3.5Ag/Cu solder joints by pre-annealing processS. H. KimJin Yu
- Robustness and Versatility of Thin Films on Low Temperature Cofired Ceramic (LTCC)J. A. WolfK. A. PetersonP. T. ViancoM. H. JohnsonS. Goldammer
- Impact of Process Tolerances on the Performance of Bond Wire Antennas at RF/Microwave FrequenciesIvan NdipAbdurrahman ÖzChristian TschobanStefan SchmitzMartin Schneider-RamelowStephan GuttowskiHerbert ReichlKlaus-Dieter Lang
- Z-axis Interconnections for Next Generation PackagingRabindra N. DasFrank D. EgittoJohn M. LaufferTim AntesbergerVoya R. Markovich
- IC Bond Pad Structural Study by “Ripple Effect”Jose MartinezCesar SalasMarco SalasJason SchofieldSteven SheffieldKyle WilkinsStevan Hunter
- Materials Interaction in Cofired Platinum /Alumina High Density Feedthrough for Implantable Neurostimulator ApplicationsAli KarbasiW. Kinzy Jones
- Developments in Stencil Printing Technology for 0.3mm Pitch CSP AssemblyMark WhitmoreClive Ashmore
- Quality and Reliability of 3D TSV Interposer and Fine Pitch Solder Micro-bumps for 28nm TechnologyBahareh BanijamaliRaghunandan ChawareSuresh RamalingamMyongseob Kim
- Applicability of Existing Reliability Models: Focus on Finite Element Modeling of Various BGA Package Designs and MaterialsAli Fallah-AdlAmaneh TasoojiRavi MahajanNachiket RaravikarRichard HarriesSandeep Sane
- Why Wedge Bond?Joe BubelLee Levine
- Ageing characteristics of Cu Wire Bonds on Palladium Surface FinishesMustafa OezkoekHorst ClaubergHugh Roberts
- ELECTRICAL BEHAVIOR OF A DOUBLE SIDED PV SOLAR PANELV. GanescuR. ShoaffA. Pascu
- Piezoelectric Nanogenerators for Mechanical Energy HarvestingXudong Wang
- Wafer Level Integration of MMIC and Microwave IPD with Metal/BCB Multilayer Interconnection Based on Low Resistance SiliconJiajie TangLe Luo
- CubeSat Fabrication through Additive Manufacturing and Micro-DispensingCassie GutierrezRudy SalasGustavo HernandezDan MuseRichard OlivasEric MacDonaldMichael D. IrwinRyan WickerMike NewtonKen ChurchBrian Zufelt
- Wafer Bumping and Characterizations of Fine-Pitch Lead-Free Solder Microbumps on 12” (300mm) wafer for 3D IC IntegrationJ. H. LauP-J TzengC-K LeeC-J ZhanM-J DaiLi LiC-T KoS-W ChenH. FuY. LeeZ. HsiaoJ. HuangW. TsaiP. ChangS. ChungY. HsuS-C ChenY-H ChenT-H ChenW-C LoT-K KuM-J KaoJ. XueM. Brillhart
- Thin Wafer Handling of 300mm Wafer for 3D IC IntegrationH. H. ChangJ. H. LauW. L. TsaiC. H. ChienP. J. TzengC. J. ZhanC. K. LeeM. J. DaiH. C. FuC. W. ChiangT. Y. KuoY. H. ChenT. H. ChenT. K. KuW. C. LoM. J. Kao
- MEMS Packaging with 3D-MID TechnologyNouhad Bachnak
- RF Sensitivity of Multi Chip Package Development by Using Embedded Resistor in Package SubstrateWoong-Sun LeeSang-Joon LimHeung-Jae ShinJong-Tae LeeJung-Kwon ParkQwan-Ho ChungKwang-Yoo Byun
- Fully Additive Chip Packaging: Science or Fiction?Gerrit OosterhuisBen van der ZonHessel MaalderinkPar Dunias
- Mix of analog and digital circuitry analysis in a noisy environmentHugues TournierKaisheng HuShuhui Deng
- APPLICATIONS OF SOLDER PREFORMS TO IMPROVE RELIABILITYCarol GowansSeth HomerRonald Lasky
- The Mechanism of The Die Crack in exposed Pad Quad Flat Package(ePad QFP) with Large Die due to Die-attach Adhesive with high modulusJin-Ho KimDong-Nam KimYoung-Chul JoNam-Yong KimSeung-Geun KangByung-Ju LeeDal-Soo KimTea-Seob YunSung-Jun Kim
- Extreme Temporary Coatings and Adhesives for High-Thermal, Low-Pressure, and Low-Stress 3D-ProcessingJared PettitJohn Moore
- Simulation of Huge Data Processing via Large Matrix Manipulation Using Hilbert EngineAn DangJoan DelalicSon NguyenBjorn GruenwaldYuk LaiHoi Man Chang
- Advanced Thermal Study of Very High Power TSV Interposer and Interconnects for 28nm Technology FPGABahareh BanijamaliSuresh RamalingamRaghunandan Chaware
- Solder Strength Characterization Using Hot Bump Pull TestingKevin O’ConnellArv Sinha
- Mobile Device Passive Integration from Wafer ProcessKai LiuYongTaek LeeHyunTai KimMaPhooPwint Hlaing
- 3D Packages and Assembly MethodologiesBernd K Appelt
- Resistance Brazing of Alumina Ceramic to Titanium Using Pure GoldMohammad SiddiquiW. Kinzy Jones
- Design, Development and Qualification of 64 Channel Hybrid Analog Multiplexer for Space applicationsKrishnaprasad KrishnaprasadGayathrikumari GayathrikumariSantosh JoteppaSatyanarayana PrasadVinod ChippalkattiAmul PatelJ C KareliaKG DomadiaRM Parmar
- Oxide Liner, Barrier and Seed Layers, and Cu-Plating of Blind Through Silicon Vias (TSVs) on 300mm Wafers for 3D IC IntegrationChien-Ying WuShang-Chun ChenPei-Jer TzengJohn H. LauYi-Feng HsuJui-Chin ChenYu-Chen HsinChien-Chou ChenShang-Hung ShenCha-Hsin LinTzu-Kun KuMing-Jer Kao
- Molding Flow Modeling and Experimental Study on Void Control for Flip Chip Package Panel Molding with Molded Underfill TechnologyJonathan TamilSiew Hoon OreKian Yeow GanYang Yong BoGeraldine NgPark Teck WahNathapong SuthiwongsunthornSurasit Chungpaiboonpatana
- Optoelectronic Substrate With High-Aspect-Ratio Optical Through-Hole for Chip-to-Chip InterconnectsAtsushi SuzukiYutaka TakagiToshikazu HorioToshifumi KojimaToshikatsu TakadaSatoshi IioMasahiko Okuyama
- Heterogeneous integration – packaging on and in organic substratesKarl-F. BeckerT. BraunJ. BauerL. BöttcherA. OstmannB. PahlJ. HaberlandC. KallmayerR. AschenbrennerM. Schneider-RamelowK.-D. Lang
- High Melting Temperature Lead Free Solder for Die Attach ApplicationJianxing LiDaniel LauPingliang TuAndrew DelanoBrian Knight
- An Electrical Testing Method for Blind Through Silicon Vias (TSVs) for 3D IC IntegrationShyh-Shyuan SheuZue-Hua LinJui-Feng HungJohn H. LauPeng-Shu ChenShih-Hsien WuKeng-Li SuChih-Sheng LinShinn-Juh LaiTzu-Kun KuWei-Chung LoMing-Jer Kao
- Simultaneous Characterization of Theta-JC and Theta-JB Using Through-Package 1-D Heat FlowJichul KimJae Choon KimMina ChoiEunseok ChoHyunggil BaekHoGeon SongSayoon Kang
- Accelerated Life Tests of Flip-Chips With Solder Bumps Down to 30 μm DiameterRainer DohleStefan HärterJörg GoßlerJörg Franke
- Packaging and Integration Concept for High-Performance and Cost-effective IQM-based Transmitter Module for 160 Gb/s ApplicationsG. DelrossoB. CurranM. RothermundU. MaaßH. OppermannI. Ndip
- Cost effective Precision 3D Glass Microfabrication for Electronic PackagingJeb H. FlemmingKevin DunnJames GoukerCarrie SchmidtColin Buckley
- Power Efficiency Improvement for Low Ohm Current Sense Resistor by Optimum Thermal ManagementAkhlaq RahmanFred Olinger
- Pure Copper Solder Paste with Sub-200 °C Processing TemperatureAlfred A. ZinnFrances Y. Chiu
- Improvement of Rated Power and VSWR Characteristics for Termination Resistor with Integrated Matching Network and Efficient Thermal ManagementAkhlaq RahmanFred Olinger
- The Road towards Fully Hybrid CMOS Imager Sensors.Joeri De VosAnne JourdainWenqi ZhangKoen De MunckPiet De MoorAntonio La Manna
- Embedded Capacitors on Silicon Interposers Enable Higher Frequency ApplicationsSergey SavastioukJames HewlettPhil Marcoux
- Single Probe for Bare Board Continuity and Isolation TestingAbdelghani RenbiJerker Delsing
- Location of the Critical Solder Joint of a PBGA under Temperature Cycling Load for SAC and SnPb Solder. Results of Experiments vs. FE-Simulations on System and Board Level.Natalja SchafetBruno SchremppManfred SpraulUlrich BeckerHerbert Güttler
- Embedded Actives and Its Industry EffectsRay Fillion
- Thermal and Mechanical Characterization of High Power GaN PackagesDon WillisGary GuDaniel JinRob Dry
- Hardware Design for Multiple Gas Detection System Using Zeolite Coated with Nile RedSon NguyenZ. Joan DelalicDavid M. KargboJoel B. SheffieldZameer Hasan
- Meter for the measurement heat of combustionZbigniew Magonski
- Strength and Reliability Estimation of a Low Temperature Co-Fired Ceramic (LTCC) With and Without Metallic FeaturesRajan TandonClay S. Newton
- Sputter deposition of thin film MIM capacitors on LTCC substrates for RF bypass and filtering applicationsJack MurrayWayne HuebnerMatthew J. O’KeefeKristina WilderRyan EatingerWilliam KuhnDaniel S. KruegerJ. Ambrose Wolf
- TEMPORARY PROTECTIVE PACKAGING FOR OPTICAL MEMSL. BogaertsA. PhommahaxayC. GeretsP. JaenenR. Van HoofS. SeveriM. Van De PeerJ. De CosterR. BeernaertS. RudraA. La MannaP. SoussanA. Witvrouw
- Near-Zero Shift Attachment for Optoelectronic ComponentsRoy J. Bourcier
- Fabrication of an electrostatically actuated impingement cooling deviceB. MajeedB. JonesH. OprinsB. VandeveldeD. S. TezcanP. Fiorini
- Towards highly conductive silver pastes for LTCC power electronicsMarkus EbersteinChristel KretzschmarThomas SeutheManja MarcinkowskiMartin IhleSteffen ZiescheUwe PartschFrieder Gora
- Photonic Curing Explanation and Application to Printing Copper Traces on Low Temperature SubstratesK. A. SchroderIan M. RawsonDave S. PopeS. Farnsworth
- Bond Over Active Circuitry Design for ReliabilityStevan HunterJose MartinezCesar SalasMarco SalasJason SchofieldSteven SheffieldKyle WilkinsBryce RasmussenTroy RuudJim Workman
- Superhydrophobic Coatings on Electronic ComponentsAndrew JonesVinod Sikka
- A Path Toward Non-Destructive 3D Metrology for Through-Silicon ViasJeff GelbLayWai KongLuke HunterAllen GuTiffany FongAlain C. DieboldS. H. LauWenbing Yun
- Technologies and Trends to Improve Power Electronic PackagingM. Schneider-RamelowM. HutterH. OppermannJ.-M. GöhreS. SchmitzE. HoeneK.-D. Lang
- Making Sense of Laminate Dielectric PropertiesRich PangierMichael J. Gay
- How Silver Powder Metallurgy Affects the Physical Properties of Low Temperature Firing Silver ConductorSamson ShahbaziMark Challingsworth
- Topography and Deformation Measurement as a new Tool for Thermal Stress Assessment on Electronics ComponentsMichael Hertl
- ASSESSMENT AND CHARACTERIZATION OF STRESS INDUCED BY VIA-FIRST TSV TECHNOLOGYG. ParèsF. De CrecyS. MoreauC. MauriceA BorbelyJ. MazuirL.L. ChapelonN. Sillon
- Materials Selection and Processing Techniques for Small Spacecraft Solar Cell ArraysN. Meetra TorabiJanet K. LumppJames E. Lumpp
- Direct Printing for Next Generation High Density PackagingXudong ChenKenneth Church
- Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free ProcessesCheryl TulkoffGreg Caswell
- Surface Energy and Wettability Study of Flip Chip Packaging MaterialsJinlin Wang
- Design and characterization of a biocompatible packaging concept for implantable electronic devicesMaaike Op de BeeckKaren QianPaolo FioriniKarl MalachowskiChris Van Hoof
- Low temperature reliability of carbon nanotube/silicone superhydrophobic coatingsYoonchul SohnSangeui LeeDongouk KimKunmo ChuDongun KimHajin KimIntaek Han
- 3D-stacking of UTCPs as a module miniaturization technologyS. PriyabadiniA. GielenK. DhaenensW. ChristiaensS. Van PutG. KunkelA.E. PetersenJ. Vanfleteren
- A Study of Solder Joint Failure CriteriaJianbiao PanJulie Silk
- Electro-migration Behavior in Micro-joints of Sn-57Bi solder and Cu Post BumpsKei MurayamaTaiji SakaiNobuaki ImaizumiMitsutoshi Higashi
- Rated Power Enhancement of Termination Resistor by Employing Innovative Thermal Management TechniquesAkhlaq RahmanFred OlingerMichael Howieson
- Printable Materials and Devices for Next Generation PackagingRabindra N. DasHow T. LinJianzhuang HuangJohn M. LaufferMark D. PoliksVoya R. Markovich
- Bulk and In-Circuit Dielectric Characterization of LTCC Tape Systems Through Millimeter Wave Frequency RangeBradley ThrasherDeepukumar NairJames ParisiGlenn OliverMichael A. Smith
- High Thermal-Transient Packaging for a SiC-Based Solid State Circuit BreakerTheodore BaltisDouglas C HopkinsJames M PitaressiDonald R Hazelmyer
- Electrical Performance of Advanced Surface Laminar Circuit in High-end FCBGA ApplicationsMakoto ShiroshitaSatoshi NakamuraKenji TeradaKimihiro Yamanaka
- Feasibility Study of a 3D IC Integration System-in-Packaging (SiP) from a 300mm Multi-Project Wafer (MPW)J. H. LauC-J ZhanP-J TzengC-K LeeM-J DaiH-C ChienY-L ChaoW. LiS-T WuJ-F HungR-M TainC-H LinY-C HsinC-C ChenS-C ChenC-Y WuJ-C ChenC-H ChienC-W ChiangH-H ChangW-L TsaiR-S ChengS-Y HuangY-M LinT-C ChangC-D KoT-H ChenS-S SheuS-H WuY-H ChenW-C LoT-K KuM-J KaoD-Q Hu
- Very High Lead Count SMT Backplane Connector Rework Process: Recognizing the ChallengesJim BielickMitchell G. FerrillEddie KobedaTheron Lewis
- Aerosol Jet® Printer as an Alternative to Wire Bond and TSV Technology for 3D Interconnect ApplicationsMichael J. O’ReillyJeff LealSuzette K. PangrleKenneth Vartanian
- ToF-SIMS Analysis of Fiberglass Cloths for PCB ManufacturingDylan BodayMichael HaagJoe KuczynskiMarkus SchmidtMichael WahlJohannes Windeln
- A STUDY OF SURFACE FINISHES FOR IC SUBSTRATES AND WIRE BOND APPLICATIONSJohn GanjeiErnest LongLenora Toscano
- Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV)Heng-Chieh ChienJohn H. LauYu-Lin ChaoRa-Min TainMing-Ji DaiSheng-Tsai WuWei-Chung LoMing-Jer Kao
- Investigating Stress in Hybrid Electronic Packages Using White Light Surface ProfilometryKelsey A. FolgnerChing-Yao TangMichael J. O’BrienPeter D. Fuqua
- Electromagnetic Isolation Solutions in Low Temperature Cofired Ceramic (LTCC)Daniel KruegerKen PetersonLaurie Euler
- Mold Compound Adhesion Reliability with SiN and SiON PassivationVarughese MathewSheila ChopinTrent UehlingRuzaini Ibrahim
- Localized Temperature Stability in A Multilayer LTCC PackageSteve Dai
- Impact of PCB Manufacturing Process Variations on Trace ImpedanceAbdelghani RenbiJohan CarlsonJerker Delsing
- Properties and Reliability of Silicon Nitride Substrates with AMB Copper ConductorBöhm GabyBrunner DieterSichert InaPönicke AndreasSchilm Jochen
- Enhancing Reliability of LEDs and other Display DevicesRakesh Kumar
- Finding “The Buffy” Talent Acquisition and Retention in Today’s MarketPatrick J. G. Troy
- MEMS Integrated Packaging for RF Circuit Testing and Self CalibrationSukeshwar KannanBruce KimNaga Sai EvanaAnurag GuptaSeok-Ho Noh
- Evaluation of Test Protocol for Eutectic Die Attach Using High Power LEDsAmanda HartnettSeth HomerDonald BeckDaniel Evans
- Epoxy Flux – A Low Cost High Reliability Approach for PoP AssemblyNing-Cheng Lee
- Interference of Sb(III) in the Determination of Hexavalent Chromium in Thermoplastic MatricesSophia S. LauJoe P. Kuczynski
- Vacuum Packaging for High-Performance Low Cost MEMS Gyro Used in 6 Degree of Freedom Inertial Navigation System (DOF INS)D. DeRooK. ShcheglovM. InbarD. SmukowskiP. ZappellaP. Barnes
- Mechanical Stress Impact of Assembly Processes onto a Stress-sensitive TestchipH. TheussK. ElianM. FinkM. FriesF.-P. KalzB. SchwabeM. VaupelC. JaroschekA. SchubertH. HummelO. Steffens
- Three-Dimensional Surface in LTCC for a MM-Wave AntennaPeter UhligSybille HolzwarthBahram SanadgolAlexandra Serwa
- Modifiable Silicones for Harsh EnvironmentsMichelle VelderrainMatthew Lindberg
- LÉTI’S TWO STEP APPROACH IN THE DOMAIN OF 3D INTEGRATIONAndré RouzaudNicolas SillonMark ScannellDavid HenryT. Mourier
- Use of Wafer Applied Underfill for 3D StackingAntonio La MannaK. J. RebibisC. GeretsE. Beyne
- Overview on Thermal and Mechanical Challenges of High Power RF Electronic PackagingCadmus YuanRené KregtingWillem van DrielSander GielenAn XiaoG. Q. (Kouchi) Zhang
- DNA Marking and Authentication: A unique, secure anti-counterfeiting program for the electronics industryJames A. HaywardJanice Meraglia
- Packaging Technology of Multi Deflection Arrays for Multi-Shaped Beam LithographyT. BurkhardtM. MohauptM. HornaffB. ZaageE. BeckertH.-J. DöringM. SlodowskiK. ReimerM. WittR. EberhardtA. Tünnermann
- Use of Polyalkylene Carbonate Binders for Improved Performance in Multilayer Ceramic CapacitorsPeter FerraroSugianto HanggodoIan BurnAmanda BakerWeiguo Qu
- Applications of 3D X-Ray Microscopy for Advanced Package DevelopmentK. FaheyR. EstradaL. MirkarimiR. KatkarD. BuckminsterM. Huynh
- Which Frequency is Best for Wirebonding?Josef SedlmairFarhad FarassatFranz Schlicht
- Influence of film thicknesses on the electrical properties of RuO2-thick film resistors on aluminum nitride ceramics (AlN)Richard SchmidtChristel KretzschmarMarkus Eberstein
- Design and Fabrication of WLP Compatible Miniaturized Pressure Sensor System with Through Silicon Via (TSV) InterconnectsTao WANGJian CAIQian WANGHao ZHANGZheyao WANG
- Case Study: Radial Cracks in a Rigid-Flex AssemblyChristopher Matsuoka
- High-Fidelity Optical Microphone Manufactured in LaminatesJonas TsaiYang ZhangG.P. LiMark Bachman
- Through Silicon Vias and Holes Metallization using CoWP and Cu Nanoparticles as Barrier and Seed LayersWei-Ping DowShao-Ping ShenChun-Wei LuYiu-Hsiang ChangMotonobu KuboTohru KamitamariEric ChengJing-Yuan LinFu-Chiang Hsu
- NanoBond® Assembly – A Rapid, Room Temperature Soldering ProcessJacques Matteau
- Surface Properties of Laser-etched LTCC CeramicKrzysztof ZaraskaJanina GaudynAdam BieńkowskiAndrzej CzerwińskiMariusz Płuska
- Build-up Electrical Insulation Material with Low-Dielectric Loss Tangent, Low-CTE and Low-Surface RoughnessEita HORIKIIsao SUZUKIToshiaki TANAKAAkihiro UENISHIHiroshi KOUYANAGI
- Transfer molding technology for smart power electronics modules - materials and processesK.-F. BeckerD. JoklitschkeT. BraunM. KochT. ThomasT. Schreier-AltV. BaderJ. BauerT. NowakO. Bochow-NessR. AschenbrennerM. Schneider-RamelowK.-D. Lang
- A Novel Design of a Planar SOFC with the Anode Supported on the Base Ceramic StructureBarbara DziurdziaZbigniew Magonski
- Comparison Between Multilayer Ceramic and Organic Package Substrates Based Upon Signal and Power IntegrityJerry AguirrePaul GarlandMarcos VargasHeather TalloJoseph Tallo
- A First Room Temperature Stable and Jetable Solder Joint Encapsulant AdhesiveMary LiuWusheng Yin
- Thermal Performance of an Adhesive Bonded Superconducting Multichip Module (MCM) on a Gifford-McMahon CryocoolerRanjith JohnVladimir DotsenkoDeepnarayan GuptaAjay Malshe
- Evaluation of electromigration in flip-chip solder jointsHyun-Kyu LeeYong-Chul ChuMyung-Ho ChunSang-Ho JeonJung-Ug KwakSeung-Jin LeeSung-Mun Bae
- Optimization of a Flux-Less Metal Thermal Interface Material by Reflow in a Vacuum FurnacePierino I ZappellaPaul W BarnesDavid MuhsBruce Wilson
- GaN based RF Modules - Demands & Needs for PackagingM. OppermannK. WidmerR. ReberH. SledzikP. SchuhU. SchmidB. BunzS. ChartierK. DrüekeM. Bedenbecker
- Studies of Mesoscale Models Parameterized by Molecular Models for Interface Failure in Epoxy Molding CompoundsNancy Iwamoto
- Substrate Transfer for GaN based LEDs grown on SiliconNga P. PhamMaarten RosmeulenCindy DemeulemeesterVasyl MotsnyiDeniz S. TezcanHaris Osman
- Mechanical Robustness of Solder Connections to Thick Film GoldThomas F. MarinisJoseph W. Soucy
- The Reliability Impact of Reballing COTS Pb-Free BGAs to Sn/Pb for Military ApplicationsGreg CaswellJoelle Arnold
- High-quality multiple global layers on chip-redistributed wafer for wafer-level system integration using pseudo-SOCAtsuko IIDAYutaka ONOZUKAHiroshi YAMADAToshihiko NAGANOKazuhiko ITAYA
- Automated Precision Assembly for High-Volume HB LEDsDonald J. BeckJessica Sylvester
- An Innovative Printed Circuit Board Power Delivery SchemeZhenggang ChengPeter GunadisastraAmit Agrawal
- Analysis and Control of Interface Reactions in Microelectronic SystemsJ.H. PerepezkoS.D. ImhoffR. Sakidja
- Introducing DuPont™ GreenTape™ 9K5 Low Dielectric Constant, Low Temperature Co-Fired Ceramic (LTCC) Tape SystemDeepukumar M. NairJames ParisiK.M. NairMark McCombsMichael SmithElizabeth HughesKen SoudersAnthony OrzelBradley ThrasherStephen C. BeersJ.C. MalerbiScott Gordon
- An Innovative High Thermal Conductive Solderable AdhesiveMary LiuWusheng Yin
- Studying the Impact of Return Current Path on the EM Simulation of High-speed Package DesignsDarryl KostkaAntonio Ciccomancini Scogna
- Wafer Level Solder Bumping and Flip Chip Assembly with Solder Balls Down to 30μmThomas OppertRainer DohleJörg FrankeStefan Härter
- Microstructure Observation of Electromigration Behavior in Peripheral C2 Flip Chip Interconnection with Solder Capped Cu Pillar BumpYasumitsu OriiKazushige ToriyamaSayuri KoharaHirokazu NomaKeishi OkamotoDaisuke ToyoshimaKeisuke Uenishi
- Development of Laser Direct Ablation Process on Solder Resist in Printed Circuit BoardsChangbo LeeDaejo HongSuil KimCheolho ChoiChangSup Ryu
- High resolution analyzes of resistance behavior in eWLB metal contactsS. Klengel (Bennemann)M. KrauseL. BertholdM. PetzoldJ. FörsterK. PresselT. Meyer
- Zero-Power MEMS Sensor Actuated RFID SystemYang ZhangKerchia ChenSean BurkeScott McLaughlinG. P. LiMark BachmanDennis RiegerWinston Ho
- Screen printed RFID antennas on low cost flexible substratesKamil JaneczekMałgorzata JakubowskaGrażyna KoziołAnna MłożniakJanusz Sitek
Bubel, Joe, and Lee Levine. 2011. “Why Wedge Bond?” IMAPSource Proceedings 2011 (1): 582–88. https://doi.org/10.4071/isom-2011-WA4-Paper3.